Wire Bonding Head Layout for Rigid, Accurate Large-Work Bonding

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Solution Overview

Problem

Existing wire bonding apparatuses face low work efficiency and position accuracy issues when applied to large battery assemblies due to decreased support rigidity of the bonding head as the work area increases.

Innovation Solution

A wire bonding apparatus with high support rigidity, featuring a conveying unit, multiple bonding heads, and a moving unit with a beam member and columnar members to maintain accurate positioning and movement of the bonding heads across a larger work area, utilizing a combination of conveying mechanisms for precise pallet and workpiece handling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the work area of the bonding head is increased to accommodate large battery assemblies, then the productivity is improved, but the support rigidity of the bonding head decreases causing deterioration in position accuracy

Engineering Contradiction:
Improvework efficiencyVSAvoidposition accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The bonding head is divided into multiple independent bonding units (first bonding unit and second bonding unit) that can operate simultaneously on different battery cells. This segmentation allows the system to handle larger work areas with multiple bonding operations occurring in parallel, thereby maintaining high productivity while each individual bonding unit retains adequate support rigidity for precise positioning.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a conveying unit that moves battery cells in a direction perpendicular to the movement of the bonding head. This dimensional change allows the bonding head to maintain a compact structure with high support rigidity while still processing large battery assemblies by advancing the workpiece through the bonding area rather than expanding the bonding head's travel distance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If a single bonding head is used for wire bonding, then the device complexity is reduced, but the productivity decreases requiring sequential processing

Engineering Contradiction:
Improvestructure simplicityVSAvoidwork efficiency
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

Multiple bonding units are merged into a single integrated bonding head structure that can perform wire bonding operations on multiple battery cells simultaneously. The bonding units share common components such as the wire supply mechanism and control system, which reduces overall device complexity while enabling parallel processing to improve productivity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The bonding head is designed with multi-functional bonding units that can perform wire bonding operations on different types of battery cells using the same structural framework. This universality allows a single bonding head structure to handle various bonding tasks simultaneously, improving productivity without proportionally increasing device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Productivity

If the bonding head moves continuously across the work area, then the productivity is improved, but the position accuracy deteriorates due to reduced support rigidity

Engineering Contradiction:
Improvework efficiencyVSAvoidposition accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

Instead of moving the bonding head continuously across the work area, the patent inverts the approach by moving the battery cells through a stationary bonding head using a conveying unit. This inversion maintains the bonding head in a fixed position with high support rigidity, ensuring accurate positioning while the conveying mechanism enables continuous processing for improved productivity.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

A conveying unit is introduced as an intermediary mechanism between the bonding head and the battery cells. This mediator transfers the battery cells through the bonding area, allowing the bonding head to remain stationary with high support rigidity while still achieving continuous processing and high productivity through the mediated transport of workpieces.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS20240014432A1Wire bonding apparatus and control method
Publication Date: 2024.01.11 HIRATA CORPORATION
  • US20240014432A1 patent drawing
  • US20240014432A1 patent drawing
  • US20240014432A1 patent drawing

AI summary

A wire bonding apparatus includes a conveying unit configured to convey a pallet on which a work is placed, at least one bonding head configured to perform wire bonding for the work, and a moving unit configured to move the at least one bonding head. The conveying unit includes a first conveying unit configured to convey the pallet to a work region, and a second conveying unit configured to convey the pallet in the work region. The second conveying unit includes a table with a positioning unit configured to positioning the pallet, a second moving mechanism configured to repeat moving the table and stopping the table. A positioning state of the pallet by the positioning unit is kept while the pallet is conveyed, and the at least one bonding head performs work for the work.