Wire Bonding Horn Control for Lead-Aligned Ultrasonic Vibration
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Solution Overview
Problem
The miniaturization of ICs leads to narrower leads, causing deformation and quality degradation in wire bonding due to mismatched ultrasonic vibration directions, and existing solutions complicate the structure or fail to consider lead orientation, resulting in prolonged bonding times and reduced joining quality.
Innovation Solution
A wire bonding apparatus with an ultrasonic horn capable of dual-frequency vibration in the Y-direction and X-direction, adjusted by a control unit to match the lead orientation, reducing vibration energy applied in the width direction and using an imaging device to calculate lead angles and widths for precise amplitude adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the ultrasonic vibration direction is matched with the lead extending direction by rotating the placement table or using two ultrasonic horns, then the wire resonance is suppressed and junction quality is improved, but the device structure becomes complicated and bonding time increases
Solution Approach 1:
The patent applies dynamics by making the ultrasonic horn capable of changing its vibration direction dynamically. The horn is designed to vibrate not only in the Y-direction (extending direction) but also in the X-direction (width direction) simultaneously through XY mixture excitation. This dynamic vibration capability allows the system to adapt to leads of different orientations without mechanical rotation or multiple horns, thus improving junction quality while maintaining simple structure.
Solution Approach 2:
The patent changes the vibration parameters of the ultrasonic horn by applying two different frequencies: a first frequency for Y-direction vibration and a second frequency for X-direction vibration. By controlling the ratio of amplitudes between these two directions, the system can optimize the vibration energy distribution to match lead orientations, suppressing wire resonance and improving bonding reliability without complicating the device structure.
2Adaptability or versatility
If XY mixture excitation is applied to ultrasonically vibrate the capillary in both Y-direction and X-direction, then the vibration energy distribution can be adjusted, but the lead deformation still occurs when the ultrasonic vibration direction does not match the lead extending direction
Solution Approach 1:
The patent introduces feedback by using an imaging device to detect the extending direction of the lead, and a control unit to process this information and calculate the optimal amplitude ratio between Y-direction and X-direction vibrations. This closed-loop feedback system ensures that the ultrasonic vibration parameters are precisely adjusted to match the lead orientation, preventing lead deformation while maintaining the adaptability of XY mixture excitation.
3Reliability
If the placement table is rotated to match the ultrasonic vibration direction with the lead extending direction, then the wire resonance is suppressed and bonding quality is improved, but the bonding process time increases
Solution Approach 1:
The patent applies preliminary action by pre-calculating and storing the optimal amplitude ratio between Y-direction and X-direction vibrations for different lead orientations. The control unit uses the detected lead extending direction to directly retrieve and apply the appropriate vibration parameters, eliminating the need for time-consuming mechanical rotation or iterative adjustment during the bonding process, thus improving bonding quality while reducing process time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the configuration, reduces deformation, and enhances the quality of wire-electrode junctions by aligning vibration energy with lead orientations, thereby improving bonding efficiency and quality.
Implementation Method 1
an ultrasonic horn to which two ultrasonic vibrations can be input to excite a bonding tool mounted to a front end with different frequencies in a Y-direction and an X-direction perpendicular to the Y-direction
Implementation Method 2
the control unit adjusts the respective magnitude of the two ultrasonic vibrations to adjust a ratio of amplitude of the bonding tool in the Y-direction and the X-direction
Data Source
AI summary
The present invention includes: an ultrasonic horn (14) to which two ultrasonic vibrations can be input to excite a capillary (15) mounted to a front end with different frequencies in a Y-direction and an X-direction; and a control unit (50) which adjusts the respective magnitude of the two ultrasonic vibrations. The Y-direction is a direction in which the ultrasonic horn (14) extends. The control unit (50) adjusts the respective magnitude of the two ultrasonic vibrations to adjust a ratio (ΔY/ΔX) of amplitude of the capillary (15) in the Y-direction and the X-direction. Thus, degradation in the quality of the joining between wires and leads is suppressed.