Wire Bonding Apparatus Real-Time Leakage Current Detection
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Solution Overview
Problem
In semiconductor packaging, failures in the bonding wire process can lead to malfunctioning multi-stack packages, reducing fabrication yields, as existing methods do not effectively detect wire open or short failures in real time during the manufacturing process.
Innovation Solution
A wire bonding apparatus with a capillary and electrical detectors that apply voltage or current to bonding pads to detect leakage currents, wire open failures, and wire short failures in real time, allowing for immediate connection decisions and preventing faulty chip stacking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is performed without real-time failure detection, then the bonding process is simple and fast, but wire open or short failures are not detected, leading to malfunctioning multi-stack packages and reduced fabrication yields
Solution Approach 1:
The patent applies preliminary action by performing electrical detection (applying voltage or current) to the bonded wire immediately after wire bonding but before proceeding to the next bonding operation. This preliminary detection identifies wire open or short failures early, preventing defective chips from being stacked subsequently, thereby improving fabrication yield without requiring complex post-assembly testing
Solution Approach 2:
The patent implements feedback by using the detection results of wire electrical properties to control subsequent bonding operations. When a wire failure is detected, the system provides feedback to stop the stacking process for that particular chip, preventing propagation of defects. This feedback mechanism ensures high reliability while maintaining a relatively simple bonding process structure
2Productivity
If real-time detection of wire failures is implemented during bonding, then fabrication yields improve, but the bonding process becomes more complex and time-consuming
Solution Approach 1:
The patent applies continuity of useful action by integrating the detection process into the bonding workflow without significant interruptions. The electrical detection is performed continuously as part of the bonding sequence, and only when failures are detected does the process pause to prevent defective stacking. This approach minimizes time loss while maintaining high productivity through continuous monitoring and selective intervention
3Adaptability or versatility
If multiple semiconductor chips are stacked in a multi-stack package, then device functionality increases, but the impact of wire bonding failures is amplified, reducing fabrication yields
Solution Approach 1:
The patent applies preliminary action by detecting wire bonding failures before multi-stack packaging is completed. By performing electrical detection on each chip's bonded wires before stacking, the system identifies and isolates defective chips, ensuring that only functional chips are assembled into multi-stack packages. This prevents amplification of wire bonding failures in the final multi-chip package, maintaining high reliability while enabling complex package functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables real-time detection and prevention of wire failures during the bonding process, reducing the likelihood of malfunctioning multi-chip packages and improving fabrication yields by ensuring only functional semiconductor chips are stacked.
Implementation Method 1
applying an operating voltage of the first semiconductor chip to the first bonding pad through the wire to determine whether a leakage current is detected
Data Source
AI summary
In a method of manufacturing a semiconductor package, a first semiconductor chip is adhered to a package substrate. An end portion of a wire is bonded to a first bonding pad of the first semiconductor chip by using a capillary. An operating voltage of the first semiconductor chip is applied to the first bonding pad through the wire to detect a leakage current. A second end portion of the wire is bonded to the first connection pad by using the capillary, according to a result of the detection.