Wire Bonding Apparatus Load Control for Defect Prevention
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Solution Overview
Problem
Conventional wire bonding apparatuses often experience bonding defects due to insufficient load application on irregularly shaped bonding portions, leading to reduced yield as defects are detected too late in the process.
Innovation Solution
A wire bonding apparatus with a load sensor and controller that continuously detects the load applied during bonding and calculates a determination value to adjust the bonding operation, preventing defects by altering the bonding conditions based on the calculated value.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wire bonding is performed without continuous load detection, then the bonding process is simple and fast, but bonding defects occur due to insufficient load application on irregularly shaped bonding portions
Solution Approach 1:
The load sensor detects the load applied to the bonding portion before the bonding operation is completed, and the controller calculates a determination value in advance. This preliminary detection and calculation allow the system to identify potential bonding defects before they occur, enabling preventive adjustment of bonding conditions rather than post-bonding inspection.
Solution Approach 2:
The system continuously detects the load during bonding, calculates a determination value, and feeds this information back to the controller. The controller then adjusts bonding conditions based on this feedback, creating a closed-loop control system that dynamically optimizes bonding parameters to prevent defects on irregularly shaped bonding portions.
2Reliability
If bonding conditions are adjusted based on real-time load detection, then bonding defects are suppressed, but the bonding process time increases due to continuous monitoring and calculation
Solution Approach 1:
The determination value is calculated in advance during the approach phase before bonding begins. By performing the calculation beforehand rather than during the actual bonding operation, the system prepares bonding condition adjustments in advance, minimizing the time added to the critical bonding path.
Solution Approach 2:
The system uses the existing load sensor data from the bonding process to automatically calculate the determination value and adjust bonding conditions without requiring additional measurement steps or manual intervention. The load data already being collected for process monitoring is repurposed for defect prevention, avoiding redundant measurements.
3Reliability
If load detection and determination value calculation are implemented, then bonding state can be estimated and defects prevented, but the apparatus complexity and cost increase
Solution Approach 1:
The system utilizes the load sensor that is already part of the bonding apparatus for its primary function of monitoring bonding load. This existing sensor is repurposed to provide data for calculating the determination value, eliminating the need for additional specialized sensors or measurement devices.
Solution Approach 2:
The load sensor serves multiple functions: it monitors the bonding load for process control, provides data for calculating the determination value, and enables estimation of bonding state. This multi-functionality reduces the need for separate dedicated components for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively suppresses bonding defects by estimating the bonding state before the operation, allowing for preventative measures to be taken, thereby increasing product yield.
Implementation Method 1
a load sensor that continuously detects the load applied from the bonding tool to the bonding portion
Implementation Method 2
an ultrasonic horn that generates the ultrasonic vibration
Data Source
AI summary
A wire bonding apparatus according to an embodiment bonds a wire to a bonding portion by generating an ultrasonic vibration in a state of pressing the wire onto the bonding portion. The wire bonding apparatus includes a bonding tool that causes the wire to contact the bonding portion and applies a load, an ultrasonic horn that generates the ultrasonic vibration, a load sensor that continuously detects the load applied from the bonding tool to the bonding portion, and a controller that controls the operation of the bonding tool and the ultrasonic horn. The controller analyzes data of the load output from the load sensor between when the wire contacts the bonding portion and when the ultrasonic vibration is generated, and controls the operation of the bonding tool and the ultrasonic horn based on an analysis result.