Wire Bonding Head Motion Coordination for Small Search Areas
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Solution Overview
Problem
Wire bonding machines face challenges in achieving high bonding efficiency while maintaining a small searching area, as large searching areas reduce efficiency and small areas can lead to chip impacts due to bonding head overshoot and residual vibrations.
Innovation Solution
A cooperative bonding method for a bonding head of a wire bonding machine, which includes a micro-motion stage with a vertical lifting mechanism. The method sets an initial height value for the vertical lifting mechanism and controls it to descend a preset distance before the bonding head completes its high-acceleration motion, thereby mitigating overshoot impacts on the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the searching area is increased to accommodate bonding head overshoot and vibrations, then chip damage is prevented, but bonding efficiency is reduced
Solution Approach 1:
The micro-motion stage performs preliminary action by descending before the bonding head completes its high acceleration motion, and rising after overshoot completion, to proactively create safe distance and eliminate the need for large searching area
Solution Approach 2:
The system transitions from static searching area approach to dynamic cooperative motion where the micro-motion stage actively adjusts its position in response to bonding head motion state, enabling precise timing of distance adjustment
2Productivity
If the searching area is decreased to improve bonding efficiency, then bonding speed increases, but the bonding head may impact the chip due to overshoot
Solution Approach 1:
The micro-motion stage acts as an intermediary between the bonding head and the chip, absorbing the harmful effects of overshoot by dynamically adjusting its position to maintain safe distance during high acceleration motion
Solution Approach 2:
The micro-motion stage applies preliminary anti-action by descending before overshoot occurs and rising after overshoot completion, proactively preventing any potential chip impact without requiring large searching area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances bonding efficiency with a reduced searching area while preventing the impact of bonding head overshoot and residual vibrations on the chip, ensuring improved bonding quality and addressing variations in chip pad heights.
Implementation Method 1
the bonding head experiences inertial impact and residual vibration upon arrival
Implementation Method 2
the bonding head experiences inertial impact and residual vibration upon arrival
Data Source
AI summary
A cooperative bonding method for a bonding head of a wire bonding machine, including setting an initial height value of the vertical lifting mechanism to be a difference value; upon receiving a bonding instruction, controlling the bonding head to perform an positioning operation on the target processing chip, controlling the vertical lifting mechanism to descend a preset distance; during the positioning operation of the bonding head on the target processing chip, when the acceleration motion and the overshoot is completed, controlling the vertical lifting mechanism to rise back; and during the rise back process, the pad of the chip does not exceed a residual vibration curve of the bonding head. This achieves the technical effect of improving the bonding efficiency of the bonding head within a small searching area while avoiding impacts on the chip caused by the overshoot during high acceleration positioning of the bonding head.