Wire Bonding Pin Wire Cutting with Pre-Bent Planned Break Point
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for forming pin wires in semiconductor devices face challenges in achieving desired height due to wire buckling and difficulty in reliable cutting, particularly when extending the wire length, leading to inconsistent pin wire formation.
Innovation Solution
A manufacturing method involving controlled movements of the capillary to form a bent part and repeated lowering and raising operations to process the bent part into a planned cut part, ensuring precise cutting of the wire at the desired height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the wire length is lengthened to form a high pin wire, then the pin wire height is improved, but the wire part is likely to buckle due to axial force during capillary lowering
Solution Approach 1:
A bent part is formed on the wire in advance before the cutting operation. This preliminary bending creates a predetermined weak point that will serve as the cut location, allowing the wire to be cut reliably without requiring it to remain perfectly straight and stable during subsequent operations.
Solution Approach 2:
The capillary is lowered and raised repeatedly multiple times to process the bent part into a planned cut part. This periodic action gradually weakens the wire at the bent location through repeated stress, ensuring reliable cutting at the desired position without causing buckling of the entire wire.
2Length of moving object
If the wire length is lengthened to form a high pin wire, then the pin wire height is improved, but the wire cutting reliability deteriorates due to easier cutting at non-scratch parts
Solution Approach 1:
Instead of treating the entire wire uniformly, a localized bent part is created at a specific position on the wire. This localized deformation concentrates the weakness at a specific point, ensuring that cutting occurs reliably at the intended location rather than at random points along the wire.
Solution Approach 2:
The bent part is formed in advance as a predetermined weak point. This preliminary action ensures that when cutting is performed later, the wire will fail at the pre-designed location rather than at an unpredictable position, greatly improving cutting reliability.
3Ease of manufacture
If the capillary is lowered with the wire part upright to cut the wire, then the cutting operation is simplified, but large axial force acts on the wire causing buckling
Solution Approach 1:
The bent part is created before the cutting operation, establishing a predetermined weak point. This allows the subsequent cutting operation to be performed with simplified downward motion of the capillary, as the wire is already prepared to fail at the bent location rather than requiring complex cutting mechanisms.
Solution Approach 2:
The repeated lowering and raising of the capillary processes the bent part into a planned cut part through gradual stress application. This periodic action weakens the wire at the bent location over multiple cycles, enabling reliable cutting with simple capillary motion while avoiding the large axial forces that cause buckling.
Data Source
AI summary
A manufacturing method of a semiconductor device includes: a first step of, after joining a wire to an electrode using a capillary, forming a wire part by moving the capillary to a third target point while feeding out the wire; a second step of forming a bent part by moving the capillary to a fourth target point while feeding out the wire; a third step of processing the bent part into a planned cut part by repeating lowering and raising of the capillary for multiple times; and a fourth step of cutting the wire at the planned cut part by raising the capillary with a wire clamper closed to form a pin wire.