Wire Bonding Search Height Adjustment for Faster Contact
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Solution Overview
Problem
Current wire bonding operations face inefficiencies due to suboptimal timing and positioning of the wire bonding tool, affecting the speed and quality of the bonding process.
Innovation Solution
A method to determine a new search height and blockout time for wire bonding processes by monitoring evaluation criteria such as seek time, seek distance, impact force, and impact squash, allowing for automated adjustments to optimize tool height and improve efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the wire bonding tool is positioned at a fixed search height above the workpiece, then the bonding operation can be performed systematically, but the time efficiency and productivity are reduced due to suboptimal positioning
Solution Approach 1:
The patent implements dynamic adjustment of the search height based on real-time monitoring of bonding evaluation criteria. The system transitions from a fixed search height to a variable search height that adapts to actual bonding conditions, thereby reducing the time required to achieve optimal contact while maintaining productivity.
Solution Approach 2:
The system continuously monitors wire bonding evaluation criteria (such as bond quality, contact force, and positioning accuracy) and uses this feedback to automatically adjust the search height. This closed-loop control enables the system to optimize the time from search height to contact based on actual performance data, improving both productivity and time efficiency.
2Productivity
If the search height is reduced to decrease the time to contact, then productivity improves, but the bonding precision and quality may deteriorate
Solution Approach 1:
The search height is dynamically adjusted based on monitored bonding criteria rather than being fixed. This allows the system to optimize the balance between speed and precision by adapting the search height to specific bonding requirements, ensuring adequate positioning accuracy while maintaining high productivity.
Solution Approach 2:
The system changes the search height parameter based on real-time monitoring of bonding evaluation criteria. By adjusting this critical parameter dynamically, the system maintains optimal positioning accuracy across varying production conditions while maximizing bonding operation speed.
3Manufacturing precision
If automated monitoring and adjustment of search height is implemented, then bonding quality and productivity improve, but the system complexity increases
Solution Approach 1:
The system implements automated monitoring of bonding evaluation criteria with feedback loops that trigger automatic adjustments to the search height. This feedback mechanism improves bonding quality through real-time optimization while keeping the system architecture relatively simple by focusing on key critical parameters rather than comprehensive system redesign.
Solution Approach 2:
The wire bonding system performs self-adjustment of the search height based on monitored criteria, reducing the need for external intervention or complex control systems. The system serves itself by automatically detecting suboptimal conditions and correcting them, thereby improving quality without proportionally increasing system complexity.
Data Source
AI summary
A method of determining a new search height for a wire bonding process is provided. The method includes the steps of: providing a search height; performing a plurality of wire bonding operations using the search height; monitoring wire bonding evaluation criteria during each of the plurality of wire bonding operations; and determining a new search height using the monitored wire bonding evaluation criteria.