Wire Bonding Status Detection for Real-Time Bond Quality Control

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing wire bonding methods lack effective real-time monitoring of bonding status between a portion of wire and a workpiece, leading to potential issues such as improper bonding, broken wires, and inadequate clamping, which can affect efficiency and yield in semiconductor device processing.

Innovation Solution

Implementing a method to monitor the bonding status during the wire bonding process by detecting contact and electrical continuity between the wire and the workpiece, using detection signals to assess bonding conditions and clamping integrity, and adjusting parameters in real-time to ensure proper bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If real-time monitoring of bonding status is implemented during wire bonding process, then bonding quality and device yield are improved, but system complexity and detection requirements increase

Engineering Contradiction:

Improvebonding qualityVSAvoidsystem complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements real-time feedback monitoring during the wire bonding process by detecting bonding status parameters (such as bond force, ultrasonic energy, temperature) as the bond is being formed. This feedback loop allows the system to monitor bonding quality continuously and make adjustments during the process, rather than only after bonding is complete, thereby improving reliability while managing system complexity through targeted parameter monitoring.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The patent replaces traditional mechanical post-bonding inspection methods with electrical and sensor-based detection systems that can monitor bonding status in real-time during the bonding process. This substitution enables continuous monitoring without requiring complex mechanical measurement apparatus, thus improving bonding quality while controlling system complexity through the use of electronic sensing technologies.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If real-time monitoring and detection during wire bonding is implemented, then improper bonding and broken wires are reduced, but detection precision and measurement capabilities must be increased

Engineering Contradiction:

Improvebonding integrityVSAvoiddetection precision

Core Design Contradiction:

ReliabilityVSMeasurement precision

Solution Approach 1:

The patent applies preliminary detection actions during the wire bonding process by monitoring bonding parameters (such as contact force, ultrasonic vibration, temperature) as the bond is being formed. This preliminary monitoring allows the system to detect potential bonding failures before they occur and adjust parameters in real-time, thereby improving bonding integrity while using achievable detection precision through multiple parameter monitoring rather than requiring ultra-precise single-point measurement.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If clamping status monitoring is added to the wire bonding system, then clamping integrity is improved, but process time and operational complexity increase

Engineering Contradiction:

Improveclamping integrityVSAvoidprocess time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent merges clamping status monitoring with the existing wire bonding process by integrating sensors that detect clamping integrity simultaneously with bonding parameter monitoring. This combined approach allows the system to evaluate both clamping status and bonding quality during the same operational cycle without requiring separate monitoring steps, thereby improving clamping integrity while minimizing additional process time through consolidated measurement functions.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances wire bonding efficiency and device yield by providing real-time feedback and enabling automatic adjustments to improve bonding quality and clamping, reducing instances of improper bonding and broken wires.

Implementation Method 1

monitoring the bonding status between the portion of wire and the workpiece during the wire bonding process

Methodology Applied

Scientific EffectElectrical continuity detection: Conduction (electrical)

Implementation Method 2

varying types of bonding energy may be used including, for example, ultrasonic energy

Methodology Applied

Scientific EffectUltrasonic energy: Ultrasonic Vibration

Implementation Method 3

varying types of bonding energy may be used including, for example, ultrasonic energy, thermosonic energy

Methodology Applied

Scientific EffectThermosonic energy:

Implementation Method 4

varying types of bonding energy may be used including, for example, ultrasonic energy, thermosonic energy, thermocompressive energy

Methodology Applied

Scientific EffectThermocompressive energy:

Data Source

PatentUS20250391812A1Methods of determining a bonding status between a portion of wire and a workpiece on a wire bonding system

Publication Date: 2025.12.25 KULICKE & SOFFA IND INC

AI summary

A method of determining a bonding status between a portion of wire and a workpiece on a wire bonding system is provided. The method includes the steps of: (a) bringing the portion of wire into contact with a bonding location of a workpiece; (b) commencing a wire bonding process between the portion of wire and the bonding location; and (c) monitoring the bonding status between the portion of wire and the workpiece during the wire bonding process.