Wire Bonding Optical Alignment for Thermal Offset Correction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor manufacturing methods face challenges in accurately maintaining positioning accuracy of tools due to temperature variations, leading to increased task times and complex temperature distributions that complicate precise bonding offset corrections.
Innovation Solution
A manufacturing apparatus and method that utilizes a first and second imaging unit to capture images of standard and reference points, respectively, allowing for real-time calculation of positioning correction amounts without suspending processing, by integrating optical elements and using a controller to adjust for bonding offset changes based on these images.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a reference member is fixed away from the tool and image light of the tool is guided to a positioning camera for imaging, then accurate bonding offset amount can be calculated, but task time for manufacturing semiconductor device is increased due to temporary suspension of processing
Solution Approach 1:
The patent combines the imaging function and tool function into a single integrated structure. The imaging unit is disposed within the tool itself, eliminating the need for separate reference members and light guidance systems. This merging allows the tool to perform both processing and self-imaging simultaneously, resolving the contradiction between measurement accuracy and time loss.
Solution Approach 2:
The tool is equipped with its own imaging unit to capture images of the workpiece and reference marks. This self-service approach eliminates the need for external imaging systems and the associated time-consuming operations of moving tools to fixed reference members. The tool independently performs imaging functions during normal operation, maintaining both accuracy and efficiency.
2Temperature
If temperature sensor is provided on tool or positioning camera to correct bonding offset amount, then temperature variation can be detected, but accurate correction is difficult due to complex temperature distribution from multiple heat sources and different materials
Solution Approach 1:
The patent uses optical imaging to create a visual copy of the reference mark position on the workpiece. Instead of relying on temperature sensors to infer positioning changes, the system directly captures images showing the actual positional relationship. This optical copying method provides accurate positioning data without being affected by complex temperature distributions from multiple heat sources and materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves positioning accuracy and reduces production time by enabling continuous processing without the need for temporary suspensions, enhancing the efficiency of semiconductor device manufacturing.
Implementation Method 1
a first imaging unit that acquires a first image obtained by imaging a standard point
Implementation Method 2
a second imaging unit that acquires a second image obtained by imaging a reference point
Data Source
AI summary
A wire bonding apparatus includes: a capillary, performing predetermined processing on a workpiece and movable with respect to the workpiece; an optical mechanism, moving together with the capillary; and a controller. The optical mechanism includes: a first imaging unit, acquiring a first image obtained by imaging a standard point set within an imaging range; and a second imaging unit, acquiring a second image obtained by imaging a reference point formed at a predetermined distance from the capillary. The controller positions the capillary with respect to the workpiece based on the first image, and calculates a positioning correction amount of the capillary based on the second image.