Wire Bonding Ultrasonic Calibration for Consistent Bond Quality
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Solution Overview
Problem
Wire bonding processes face challenges in repeatability due to variations in equipment and conditions, leading to inconsistent wire bond quality across different systems and over time, necessitating improved methods for calibrating ultrasonic characteristics.
Innovation Solution
A method involving determining reference and calibration ultrasonic characteristics through incremental adjustments to achieve desirable or unacceptable wire bond conditions, calculating a calibration factor to set a new ultrasonic characteristic setpoint for the specific wire bonding system, and applying this setpoint to ensure consistent wire bonding performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the same wire bonding parameters are used across different wire bonding systems, then the process is simple to operate, but the wire bond quality becomes inconsistent
Solution Approach 1:
The patent applies parameter changes by determining calibration factors that adjust ultrasonic characteristics (power, time, amplitude) based on measured wire bond properties. Instead of using fixed parameters across all systems, the method dynamically modifies parameters to compensate for system-specific variations, thereby maintaining consistent wire bond quality while accounting for differences between bonding systems
Solution Approach 2:
The patent implements feedback by measuring actual wire bond properties (such as bond strength or electrical characteristics) and using these measurements to calculate calibration factors. This closed-loop approach allows the system to automatically adjust ultrasonic parameters based on real performance data, ensuring consistent quality across different bonding systems without requiring manual reconfiguration
2Manufacturing precision
If wire bonding parameters are adjusted for each system variation, then wire bond quality consistency is improved, but the operation complexity increases
Solution Approach 1:
The patent applies self-service by enabling the wire bonding system to automatically determine its own calibration factors through measurement and calculation processes. The system performs self-calibration by measuring wire bond properties and adjusting ultrasonic parameters without requiring external intervention or complex manual configuration, thereby maintaining quality consistency while minimizing operational complexity
Solution Approach 2:
The patent implements preliminary action by performing calibration factor determination as a preparatory step before actual wire bonding operations. The system pre-adjusts ultrasonic parameters based on initial measurements, ensuring that subsequent bonding operations proceed with optimized settings already in place, thus maintaining quality consistency without adding complexity during production
3Adaptability or versatility
If ultrasonic characteristics are calibrated for each system, then adaptability to different systems is improved, but the calibration process time increases
Solution Approach 1:
The patent applies partial action by determining calibration factors based on specific critical measurements rather than comprehensive system characterization. The method focuses on measuring key wire bond properties that directly impact quality, calculating calibration factors only for essential ultrasonic parameters, thereby achieving adequate adaptability while minimizing the time required for calibration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the portability and consistency of wire bonding systems by adjusting ultrasonic characteristics in real-time, addressing machine-to-machine differences and material variations without requiring off-bonder metrology, thereby improving wire bond quality and reliability.
Implementation Method 1
ultrasonic energy (and associated process parameters) is often used to bond a wire to a workpiece
Data Source
AI summary
A method of calibrating an ultrasonic characteristic on a wire bonding system is provided. The method includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.