Wire Bonding Head Layout to Reduce Vibration at High Bonding Speed
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Solution Overview
Problem
Conventional wire bonding apparatuses experience increased vibration due to the misalignment of the XY driving mechanism and bonding head, leading to deteriorated bonding quality and limited bonding speed, as the gravity center of the bonding head is away from the thrust center of the XY driving mechanism.
Innovation Solution
The XY driving mechanism is reconfigured to have a portion of the Y-direction guide overlap with the bonding stage, allowing the X-direction slider and motor to be positioned closer to the bonding stage, reducing the deviation between the gravity center of the bonding head and the thrust center of the XY driving mechanism, and incorporating a rotatable bonding arm with a cross-shaped leaf spring for reduced friction and improved positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the XY driving mechanism and bonding head are arranged away from the bonding stage to prevent interference, then interference with the bonding stage is avoided, but the deviation between the gravity center of the bonding head and the thrust center of the XY driving mechanism increases, causing increased vibration and deteriorated bonding quality
Solution Approach 1:
The patent repositions the XY driving mechanism from a conventional side-by-side arrangement to a configuration where it is located above and behind the bonding stage. The Y-direction guide is positioned to overlap with the bonding stage mounting surface when viewed from above, utilizing vertical and depth dimensions to achieve closer horizontal positioning without physical interference. This dimensional reconfiguration reduces the deviation between the gravity center of the bonding head and the thrust center of the XY driving mechanism, thereby reducing vibration while preventing interference.
2Productivity
If the bonding speed is increased, then productivity is improved, but vibration increases, creating a limitation on bonding speed
Solution Approach 1:
The patent positions the XY driving mechanism such that its thrust center aligns more closely with the gravity center of the bonding head. This balanced configuration creates a counterbalancing effect where the gravitational force and driving force are more aligned, reducing the generation of vibration during high-speed operation. By minimizing the moment arm between these centers, the system can operate at higher speeds without excessive vibration, thus improving productivity while controlling harmful vibrations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces vibration and enhances bonding speed by minimizing the yawing moment and vibration around the vertical axis of the bonding head, thereby improving bonding quality and allowing for increased speed.
Implementation Method 1
incorporating a rotatable bonding arm with a cross-shaped leaf spring for reduced friction and improved positioning
Data Source
AI summary
A wire bonding apparatus (100) includes a bonding stage (12), a bonding head (20), an XY driving mechanism (30), and a frame (50). The XY driving mechanism (30) includes: an X-direction guide (31) installed to the frame (50); an X-direction slider (32), supported by the X-direction guide (31) and moving in the X direction, an X-direction mover (41) being installed thereto; a Y-direction guide (33) installed to a lower side of the X-direction slider (32); and a Y-direction slider (34), supported by the Y-direction guide (33) and moving in the Y direction, the bonding head (20) being installed thereto. The XY driving mechanism (30) is installed to the frame (50), so that a portion of the Y-direction guide (33) is overlapped with a mounting surface (12a) of a bonding stage (12) above the mounting surface (12a) and behind the mounting stage (12) in the Y direction.