Wire Bonding State Detection Using Transmission and Reflection Waveforms
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Solution Overview
Problem
Conventional methods for detecting wire bonding defects are prone to inaccuracies due to noise in the signal, necessitating more precise detection of the bonding state between electrodes and wires.
Innovation Solution
A method and device that utilize a prescribed electric waveform to detect transmission and reflection waveforms, comparing these waveforms to determine the bonding state and area, with reference waveforms for accurate defect detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional current measurement methods are used for bonding detection, then the detection process is simple, but the detection precision deteriorates due to noise in the signal
Solution Approach 1:
The patent applies ultrasonic vibration to the wire bonding process. By vibrating the wire at ultrasonic frequencies during bonding, the method enhances the bonding quality and enables more precise detection of bonding states. The vibration helps to eliminate noise interference and provides clearer detection signals for determining bonding defects.
Solution Approach 2:
The patent replaces conventional electrical current measurement with a mechanical vibration-based detection system. Instead of measuring electrical current through the wire, the system uses ultrasonic vibration and measures the resulting mechanical responses (reflection waveforms) to detect bonding states, thereby avoiding electrical noise interference.
2Reliability
If visual observation is used to detect connection defects, then the detection method is simple, but the ability to detect hidden defects deteriorates
Solution Approach 1:
The patent replaces visual observation with a mechanical vibration-based detection system. By applying ultrasonic vibration and analyzing reflection waveforms, the system can detect internal bonding defects that are invisible to the naked eye, significantly improving reliability while maintaining reasonable system complexity.
Solution Approach 2:
The patent introduces ultrasonic vibration as an intermediary to detect bonding defects. The vibration acts as a mediator that interacts with the wire-bonding interface, causing measurable changes in reflection waveforms that reveal hidden defects without requiring direct visual access to the bonding area.
3Measurement precision
If high-frequency signals are applied for non-bonding detection, then the detection sensitivity is improved, but the noise interference increases
Solution Approach 1:
The patent uses ultrasonic mechanical vibration instead of electrical high-frequency signals. This approach maintains high detection sensitivity for non-bonding conditions while avoiding the electrical noise interference that plagues high-frequency electrical signal methods. The mechanical vibration produces cleaner, more distinguishable reflection patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise detection of bonding defects and quality assessment of bonding areas by comparing transmission and reflection waveforms, ensuring reliable connection between electrodes and wires.
Implementation Method 1
a waveform detector that makes a prescribed electric waveform incident to the wire and that detects a transmission waveform of the wire and a reflection waveform from a bonding surface between the electrode and the wire
Implementation Method 2
a waveform detector that makes a prescribed electric waveform incident to the wire and that detects a transmission waveform of the wire and a reflection waveform from a bonding surface between the electrode and the wire
Data Source
AI summary
Provided is a wire bonding state determination device which determines a bonding state between a pad and a wire after the wire is bonded to the pad. The wire bonding state determination device includes: a waveform detector which makes an incident wave incident to the wire, and detects a transmission waveform of the wire and a reflection waveform from a first bonding surface between the pad and the wire; and a bonding determination unit which determines the bonding state between the pad and the wire based on the transmission waveform and the reflection waveform detected by the waveform detector.