Wire Capacitor Structure for Compact Electronic Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The miniaturization of multi-layer ceramic capacitors is limited due to manufacturing and mounting process constraints, hindering their integration in increasingly compact electronic devices.
Innovation Solution
A wire capacitor design featuring a core electrode line, a dielectric line, and a conductive layer, where the wire structure is easily mountable on a substrate and allows for adjustable capacitance through the length adjustment of the conductive layer, facilitating miniaturization and high integration in electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multi-layer ceramic capacitors are miniaturized, then the size of electronic devices can be reduced, but manufacturing and mounting process limitations prevent further miniaturization
Solution Approach 1:
The capacitor is segmented into distinct functional layers: core electrode line, dielectric line, and passivation line. This segmentation allows each layer to be optimized independently for its specific function, enabling miniaturization while maintaining manufacturability through standardized wire-based construction processes
Solution Approach 2:
The invention transitions from planar capacitor designs to three-dimensional wire-based structures extending in the longitudinal direction. This dimensional change enables compact packaging and high integration while simplifying mounting processes through vertical stacking and wire bonding techniques
2Quantity of substance
If the capacitance value is increased, then the capacitor can store more energy, but the size of the capacitor increases
Solution Approach 1:
Capacitance is adjusted by changing the length of the conductive layer exposed at the ends of the wire structure, rather than increasing overall volume. The capacitance value can be precisely controlled by adjusting the length parameter of the conductive layer, enabling high capacitance in a compact form factor
Solution Approach 2:
The core electrode line is nested within the dielectric line, which is in turn surrounded by the passivation line. This nested configuration maximizes the use of internal space for energy storage while maintaining a compact external profile, allowing high capacitance without proportional volume increase
3Productivity
If the integration density is increased, then more capacitors can be mounted on the substrate, but the mounting process becomes more complex
Solution Approach 1:
The wire-based capacitor structure serves multiple functions: the core electrode line provides electrical connection, the dielectric line provides capacitance, and the passivation line provides protection. This multi-functionality in a single integrated structure simplifies mounting while achieving high integration density
Solution Approach 2:
The capacitor structure is pre-assembled with all functional layers (core electrode, dielectric, passivation) before mounting onto the substrate. This preliminary assembly simplifies the final mounting process, as the complete capacitor unit can be directly bonded to substrate pads without complex on-site assembly procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy miniaturization and high integration of capacitors in electronic devices, allowing for adjustable capacitance and efficient mounting on substrates, thereby addressing the limitations of existing multi-layer ceramic capacitors.
Implementation Method 1
a passivation line surrounding an outer surface of the dielectric line and extending in the longitudinal direction. The passivation line may contact the outer surface of the dielectric line and includes an insulating material having a lower permittivity than that of the dielectric line
Data Source
AI summary
A wire capacitor includes a wire structure extending in a longitudinal direction and a conductive layer covering an outer surface of the wire structure. The wire structure includes a core electrode line having a wire shape and extending in the longitudinal direction and a dielectric line surrounding an outer surface of the core electrode line and extending in the longitudinal direction. The wire structure has a first end and a second end which are opposite to each other in the longitudinal direction, and the conductive layer exposes an outer circumference of the first end and the second end of the wire structure.