Wire Channel Routing in Head-Mountable Device Rims
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wearable computing devices, such as head-mountable display devices, face challenges in aesthetically integrating electronic components and wires within their structure while ensuring proper functionality and ease of manufacturing, particularly in using injection molding processes that can damage parts with crevices.
Innovation Solution
The design incorporates a wire channel within the structural components of the device, using pick-out inserts in the injection molding process to create cavities for wire routing, and secures electronic components within the side-arms of the device, allowing for modular design and sweat-resistant functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If injection molding process is used to manufacture head-mountable device, then productivity is improved, but manufacturing precision deteriorates due to damage to parts with crevices
Solution Approach 1:
The wire channel cavities are formed within the mold inserts before the injection molding process begins. This preliminary creation of cavities allows the molding process to proceed without damaging delicate creviced structures, as the cavities are pre-established as part of the mold geometry rather than being formed during the high-pressure injection process.
2Shape
If wires are routed within the frame structure, then aesthetic appearance is improved, but device complexity increases
Solution Approach 1:
The wire routing channels are merged with the existing frame structure of the head-mountable device. Rather than adding separate wire management components, the cavities are integrated directly into the frame's geometry, allowing wires to be routed through the frame itself. This combines the structural and wire routing functions into a single integrated component.
Solution Approach 2:
The wire channels are nested within the frame structure, with cavities formed inside the frame material. This nesting approach allows the wire routing pathways to be contained within the existing frame geometry, maintaining the external aesthetic appearance while providing internal pathways for wire management.
3Ease of repair
If modular design with detachable components is used, then ease of repair is improved, but manufacturing precision deteriorates due to alignment challenges
Solution Approach 1:
The electronic components are extracted from the frame structure and placed in separate detachable side-arms. This extraction allows the components to be easily removed and replaced without affecting the frame itself. The side-arms can be detached from the frame, enabling straightforward repair and maintenance of electronic components while preserving the integrity of the main frame structure.
Data Source
AI summary
The present disclosure relates to a head mountable apparatus including two rims, where an inner top portion of each rim comprises a rim cavity, where each rim cavity comprises a first section and a second section, where a depth of the first section extends from an edge of the respective rim cavity to a first depth, where a depth of the second section extends from the first depth to a bottom of the respective rim cavity, where the first section is operable to secure a lens, and where the second section is part of a wire channel that is operable to secure one or more wires; and a nose bridge connecting the two rims, where a back of the nose bridge comprises a bridge cavity that connects between the second section of each rim cavity, and where the bridge cavity is part of the wire channel.