Wire Clamp Cleaning Apparatus with Detachable Polishing Tip
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Solution Overview
Problem
Semiconductor equipment cleaning processes face challenges in precision and contamination removal, particularly in narrow gaps, where dissembling and reassembling can lead to defects and increased costs due to the need for skilled labor and prolonged processing times.
Innovation Solution
A cleaning apparatus with a detachable tip and polishing member, including a support and fixer system that allows for precise contact and adherence to the cleaning target surface, utilizing a polishing tape to clean clamp pads within a wire clamp without dissembling, and a detection and driving system for automated operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If dissembling and reassembling is performed to clean narrow gaps, then cleaning accessibility is improved, but manufacturing precision deteriorates due to lack of precision between components
Solution Approach 1:
The cleaning apparatus is divided into a body and a detachable tip portion, where the tip portion can be separated for cleaning or replacement. This segmentation allows the tip to access narrow gaps effectively while maintaining precision through controlled detachment and reattachment mechanisms.
Solution Approach 2:
The tip portion is extracted as a separate removable component from the body, allowing it to be taken out for cleaning or replacement. This extraction enables maintenance of cleaning precision without affecting the overall apparatus precision, as the tip can be independently serviced.
2Reliability
If dissembling and reassembling is performed to clean narrow gaps, then cleaning effectiveness is improved, but loss of time increases due to prolonged processing
Solution Approach 1:
The tip portion is designed to be pre-assembled with the body in a precise configuration. This preliminary precision assembly means that when the tip needs cleaning, it can be quickly removed and replaced without requiring time-consuming realignment or recalibration, thus maintaining cleaning effectiveness while reducing downtime.
Solution Approach 2:
The tip portion is designed as a replaceable component that can be quickly swapped out. Instead of performing lengthy dissembling and reassembling procedures, worn or contaminated tips can be replaced with new or cleaned ones, significantly reducing processing time while maintaining cleaning effectiveness.
3Reliability
If dissembling and reassembling is performed to clean narrow gaps, then contamination removal is improved, but device complexity increases due to skilled labor requirements
Solution Approach 1:
By segmenting the apparatus into a body and a removable tip portion, the cleaning process is simplified. The tip portion can be easily detached and cleaned without requiring complex disassembly procedures or highly skilled labor, while still achieving effective contamination removal from narrow gaps.
Solution Approach 2:
The tip portion is designed to be user-friendly for removal and replacement, allowing operators with basic training to perform maintenance. The self-contained design of the tip portion enables it to be cleaned or replaced without requiring complex tools or specialized skills, reducing device complexity while maintaining contamination removal effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective cleaning of semiconductor equipment without dissembling, reducing processing time and preventing defects associated with dissembling and reassembling, while maintaining precision and reducing personnel expenses.
Implementation Method 1
a polishing member (130) including a first surface (132) having a polishing surface and a second surface (134) opposite to the first surface (132)
Data Source
AI summary
A cleaning apparatus, including a body; a tip connected to a first end of the body, the tip including a support extending in a direction away from the body; a polishing member including a first surface including a polishing surface and a second surface opposite to the first surface; and a fixer to adhere and fix the polishing member to the support so that the polishing surface is brought in contact with a cleaning target surface.