Wire Clamp System for Laser Ablation Oscillation Control
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Solution Overview
Problem
As wire diameters decrease in medical applications, existing methods struggle to accurately and efficiently strip insulation layers from small-diameter wires used in cardiac rhythm management, neurological stimulation, and radio frequency ablation, leading to processing challenges, errors, and increased costs due to wire oscillation during the laser stripping process.
Innovation Solution
A wire ablation system that includes a spool-to-spool configuration with tensioning systems, a laser ablation processor, inspection system, and a wire clamp system to securely hold the wire on both sides of the laser ablation processor, minimizing oscillation and ensuring precise, controlled removal of insulation layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If wire diameter is decreased to meet medical application requirements, then wire fineness and suitability for medical applications is improved, but wire oscillation during laser stripping increases leading to processing errors
Solution Approach 1:
The wire clamp system applies preliminary constraining force to the wire before and during laser ablation to counteract oscillation. The clamp positions the wire securely in the support channel, creating preliminary anti-action against the harmful oscillation that would otherwise occur during laser stripping of small-diameter wires.
Solution Approach 2:
The wire clamp acts as an intermediary element between the wire and the laser ablation processor. It mediates the interaction by providing mechanical support and stabilization to the wire, enabling accurate laser processing of fine wires that would otherwise be too oscillatory to process precisely.
2Length of moving object
If wire diameter is decreased, then suitability for medical applications is improved, but processing speed and efficiency deteriorate due to oscillation
Solution Approach 1:
By clamping the wire in advance, the system prevents oscillation before it affects processing speed. This allows continuous, high-speed laser ablation without interruptions for repositioning or error correction, thereby maintaining high productivity even with very fine wires.
Solution Approach 2:
The wire clamp enables high-speed processing of thin wires by mediating the mechanical support needed for speed. Without this intermediary, the wire would oscillate too much to process quickly; with it, high-speed automated laser stripping becomes feasible even for sub-0.010 inch diameter wires.
3Manufacturing precision
If wire oscillation occurs during laser stripping, then processing accuracy deteriorates, but implementing stabilization systems increases device complexity
Solution Approach 1:
The wire clamp provides preliminary anti-action against oscillation with a simple mechanical design. Rather than implementing complex active stabilization systems, the patent uses a straightforward clamp that positions the wire in a support channel, achieving high accuracy without excessive complexity.
Solution Approach 2:
The wire clamp is a simple intermediary component that provides substantial stabilization. It is not a complex system but rather a straightforward mechanical element that effectively reduces oscillation, thereby improving accuracy without significantly increasing device complexity.
4Manufacturing precision
If wire oscillation occurs during laser stripping, then processing accuracy deteriorates, but implementing stabilization systems increases cost
Solution Approach 1:
The wire clamp provides cost-effective preliminary anti-action against oscillation. By using a simple mechanical clamp rather than expensive active stabilization systems, the patent achieves high processing accuracy at lower cost.
Solution Approach 2:
The wire clamp is a low-cost intermediary that delivers substantial performance improvement. It is a simple mechanical component that effectively stabilizes the wire, thereby improving accuracy without the high costs associated with complex stabilization systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves accurate and fast processing with reduced errors and improved tolerances, allowing for precise selective removal of wire layers, thereby enhancing manufacturing efficiency and reducing waste.
Implementation Method 1
laser ablation processor 22...portions of wire 11 can be ablated to remove layers
Data Source
AI summary
One aspect is an ablation system with a wire feed configured to feed a wire and a wire take-up configured to take-up the wire. A wire handling system is configured to advance the wire and to stop the wire between the wire feed and the wire take-up in a controlled manner. A laser ablation processor is located between the wire feed and the wire take-up, the laser ablation processor having at least one laser configured to ablate the wire when the wire is stopped. A clamp system is located between wire feed and the wire take-up and configured to clamp onto the wire when the wire is stopped.