Wire Connection Structure With Resin Positioning at Small Pitch
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Solution Overview
Problem
The existing connection structure between insulated electric wires and connected portions lacks reliability due to gaps between adjacent wires, leading to potential displacement during soldering, especially at small pitches.
Innovation Solution
A connection structure that includes insulated electric wires with exposed central conductors, adhesive application to side surfaces of wire tips, and a sealing member to cover the connections, ensuring precise alignment and enhanced reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a positioning sheet with adhesive layer is used to bond wires to connected portions, then wire positioning is achieved, but gaps between adjacent wires cause displacement during soldering reducing connection reliability
Solution Approach 1:
A resin layer is introduced as an intermediary substance between the insulating layer of the wire and the connected portion. This resin layer fills the gaps between adjacent wires and bonds them to the connected portion, preventing displacement during soldering while maintaining precise positioning. The resin acts as a mediator that eliminates the harmful effect of gaps without requiring the wire tips to be in direct contact with the connected portion.
Solution Approach 2:
The resin layer is applied beforehand to the connected portion before the wire tips are positioned. This pre-application creates a cushioning effect that prevents displacement during subsequent soldering operations. The resin layer is formulated to maintain its bonding properties during the soldering process, providing prior protection against potential displacement issues.
2Quantity of substance
If wire pitch is reduced to increase connection density, then more connections fit in limited space, but displacement risk increases due to smaller gaps between wires
Solution Approach 1:
The resin layer serves as a mediator that enables high connection density by filling the reduced gaps between adjacent wires at small pitches. This intermediary substance maintains bonding reliability even when wires are closely spaced, allowing increased connection density without sacrificing connection reliability.
Solution Approach 2:
The resin layer's physical and chemical parameters are optimized to maintain effective bonding at reduced wire pitches. By adjusting the resin's viscosity, curing characteristics, and bonding strength, the system achieves reliable connections at higher densities where traditional adhesive methods would fail due to insufficient gap space.
3Ease of manufacture
If adhesive is applied only at tip portions of wires, then positioning is achieved, but connection reliability is insufficient due to lack of lateral support
Solution Approach 1:
The resin layer extends the bonding interface from the traditional one-dimensional tip contact to a two-dimensional area covering the lateral surfaces of the wire tips. This dimensional expansion provides both positioning accuracy and enhanced connection reliability by creating a larger bonding surface area that resists displacement forces during soldering.
Solution Approach 2:
The resin layer is applied in segments along the lateral surfaces of the wire tips rather than as a single continuous layer. This segmented application provides localized bonding zones that maintain positioning while distributing stress during soldering, thereby improving overall connection reliability without compromising ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the reliability of connections by maintaining wire position stability during soldering, reducing the risk of displacement and failure, while also allowing for a reduced overall height of the connection structure.
Implementation Method 1
The sealing member is disposed on the base material to cover the tip portions of the plurality of insulated electric wires and the plurality of connected portions
Implementation Method 2
The positioning sheet has an adhesive layer and a base material film. The adhesive layer is adhered to the tip portions of the plurality of insulated electric wires
Implementation Method 3
The tip portions of the plurality of insulated electric wires are respectively soldered to the plurality of connected portions
Data Source
AI summary
A connection structure includes a plurality of insulated electric wires, a base material, a plurality of connected portions disposed on the base material, and a sealing member. Each of the plurality of insulated electric wires has a central conductor and an insulating layer covering a peripheral surface of the central conductor. The central conductor is exposed from the insulating layer at a tip portion of each of the plurality of insulated electric wires in an axial direction. The plurality of connected portions are arranged in rows. The tip portions of the plurality of insulated electric wires are respectively soldered to the plurality of connected portions. The sealing member is disposed on the base material to cover the tip portions of the plurality of insulated electric wires and the plurality of connected portions.