Wire EDM Nozzle Segmentation for Deep Groove Chip Discharge
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Solution Overview
Problem
As machining progresses and the machined groove deepens, it becomes difficult to supply machining liquid to the tip end, leading to degraded chip discharging ability and increased sagging of the cutting wire, which reduces machining precision and speed, and can result in wire breakage and surface damage.
Innovation Solution
A wire electric discharge machining apparatus with a nozzle that ejects machining liquid along the cutting wire portions, stabilizing liquid supply and pressure distribution to prevent sagging and facilitate chip discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If machining liquid is sprayed to the machined groove by using a nozzle, then machining chips can be discharged outside from the machined groove, but as machining advances and the machined groove becomes deeper, it becomes difficult to supply machining liquid to the tip end of the slit, and the discharging ability of machining chips is degraded
Solution Approach 1:
The single nozzle is divided into multiple nozzles arranged in the machining direction, with each nozzle responsible for supplying machining liquid to a specific depth range. This segmentation allows machining liquid to be supplied effectively to deep machined grooves by distributing the supply function across multiple nozzles positioned at different locations.
2Length of stationary object
If the ejecting pressure of machining liquid is increased to supply the machining liquid to the tip end of the machined groove, then machining liquid can reach deeper grooves, but the cutting wire is pushed against the workpiece surface due to sagging, and the probability of wire breakage increases
Solution Approach 1:
The single high-pressure supply is segmented into multiple lower-pressure supplies from different nozzles. Each nozzle supplies machining liquid at a moderate pressure to its local area, collectively achieving deep groove coverage without requiring excessive pressure that would cause wire sagging.
3Productivity
If one wire electrode is wound around a plurality of guide rollers to be arranged in parallel, then productivity is improved by cutting multiple pieces at a time, but the wire electrode sags due to its own weight, and machining precision is lowered
Solution Approach 1:
Guide rollers are strategically positioned at specific locations along the wire electrode path, providing localized support only where needed. This allows the wire to maintain straightness in the cutting region while still enabling parallel arrangement for multi-piece cutting, thus maintaining precision without sacrificing productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains machining precision and speed by ensuring stable liquid supply and equal pressure distribution, reducing wire sagging and breakage, and improving chip removal efficiency.
Implementation Method 1
a nozzle that ejects machining liquid from an ejection opening toward an electrode gap along the cutting wire portions
Implementation Method 2
a machining power supply that generates a pulsed machining voltage... electric discharge is generated between the cutting wire portions and the workpiece
Data Source
AI summary
A wire electric discharge machining apparatus is constructed in such a manner as to include: a wire electrode having a plurality of cutting wire portions that are separated from one another in parallel and are opposed to a workpiece; a machining power supply that generates a pulsed machining voltage; a plurality of power feed contact units that are electrically connected to the cutting wire portions and apply the machining voltage between the cutting wire portions and the workpiece; and a nozzle that ejects machining liquid from an ejection opening toward an electrode gap along the cutting wire portions.