Double-Sided Cooling Power Module With Wire-Free Gate Connections
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Solution Overview
Problem
Existing double-sided cooling type power modules face challenges in manufacturing complexity and size due to the need for connection members like wires for connecting gate electrodes to signal pins or terminals, which complicates the process and increases manufacturing time.
Innovation Solution
A double-sided cooling type power module design that eliminates the use of connection wires by directly bonding metal plates on substrates to power elements' electrodes, allowing for a compact structure and simplified manufacturing through a single sintering process, where metal plates on opposing substrates connect gate electrodes to signal pins or terminals without separate wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection members such as wires are used to connect gate electrodes to signal pins or terminals, then electrical connection is achieved, but device complexity and manufacturing time increase
Solution Approach 1:
The patent merges the connection member (wire) with the substrate structure by integrating the gate electrode connection directly into the substrate's metal layer. This eliminates the need for separate wire connections and reduces manufacturing steps while maintaining reliable electrical connection between gate electrodes and signal pins.
Solution Approach 2:
The patent extracts and removes the connection member (wire) from the power module structure. By eliminating the wire and its associated connection process, the design simplifies the manufacturing process and reduces device complexity while still achieving the necessary electrical connections through the substrate's integrated metal layers.
2Reliability
If connection members such as wires are used to connect gate electrodes to signal pins or terminals, then electrical connection is achieved, but manufacturing time increases
Solution Approach 1:
The patent combines the electrical connection function with the substrate structure itself. The metal layers in the substrate serve dual purposes as both structural support and electrical connection pathways, eliminating the need for separate wire connection steps and thereby reducing manufacturing time.
Solution Approach 2:
The electrical connection pathways are pre-formed within the substrate structure during substrate fabrication, before the power module assembly process begins. This preliminary integration of connection pathways eliminates the need for time-consuming wire connection steps during module assembly.
3Reliability
If connection members such as wires are used to connect gate electrodes to signal pins or terminals, then electrical connection is achieved, but the power module size increases
Solution Approach 1:
The patent integrates the electrical connection function into the substrate's metal layers, eliminating the need for separate wire connections. This merging of functions removes the additional space required for wires and their connections, resulting in a more compact power module design.
Solution Approach 2:
The patent transitions from a three-dimensional wire connection approach to a planar, two-dimensional connection approach by utilizing the substrate's metal layers. This dimensional change allows connections to be made within the plane of the substrate rather than requiring vertical wire routing, reducing the overall module volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the manufacturing process, reduces time, and enables a more compact power module by eliminating the need for separate wire connections, while also addressing thermal expansion issues through strategically formed slits in the metal plates.
Implementation Method 1
a sintering process of bonding the first substrate, the second substrate, and the plurality of power elements to each other using the bonding material
Implementation Method 2
a first metal plate disposed at a first side of the first substrate... a second metal plate that is disposed at a second side of the second substrate and faces the first metal plate
Data Source
AI summary
A power module includes a first substrate including a first metal plate, a second substrate spaced apart from the first substrate and having a second metal facing the first substrate, a plurality of power elements that are disposed between the first substrate and the second substrate and include a first electrode and a second electrode. The plurality of power elements include a first power element having the first electrode bonded to the second metal plate, and a second power element having the first electrode bonded to the first metal plate.