Wire-Free Power Module Using Conductive Adhesive Interconnects
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Solution Overview
Problem
Wirebonding in power modules introduces additional resistance and inductance, negatively impacting performance, making it desirable to eliminate wirebonding as a means of interconnection.
Innovation Solution
A power module design featuring a thermally conductive substrate with conductive pads, where power semiconductor devices are electrically and mechanically connected using conductive adhesives, such as solder or epoxy, eliminating the need for wirebonds by using conductive clips and pads for interconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wirebonding is used to interconnect power semiconductor devices, then the assembly process is conventional and straightforward, but additional resistance and inductance are introduced which adversely affect performance
Solution Approach 1:
The patent extracts and eliminates the wirebonding element from the power module assembly, replacing it with a wire-free connection method using conductive adhesive to directly bond power semiconductor devices to the substrate, thereby removing the source of additional resistance and inductance
Solution Approach 2:
The patent replaces the mechanical wirebonding system with a chemical bonding system using conductive adhesive, substituting the physical wire connection mechanism with a direct adhesive bond that provides both mechanical attachment and electrical conduction without the parasitic effects of wirebonds
2Ease of manufacture
If wirebonding is used for interconnection, then conventional assembly methods can be employed, but multiple assembly steps are required which increases manufacturing complexity
Solution Approach 1:
The patent merges the electrical connection function and mechanical attachment function into a single conductive adhesive bonding step, combining what were previously separate wirebonding and mounting operations into one integrated process that reduces the total number of assembly steps
Solution Approach 2:
The conductive adhesive serves multiple functions simultaneously: it provides mechanical bonding to secure the power semiconductor devices, establishes electrical connections between components, and creates thermal pathways for heat dissipation, replacing the specialized functions of wirebonds with a multi-functional material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves power module performance by reducing resistance and inductance, allowing for a single solder reflow step assembly process, enhancing efficiency and reliability.
Implementation Method 1
a first power electrode electrically and mechanically connected to a respective conductive pad on the substrate by a conductive adhesive
Implementation Method 2
a thermally conductive substrate having a plurality of conductive pads disposed thereon
Data Source
AI summary
A power module that includes a power circuit assembly in which power components are electrically and mechanically connected without wires.