Wire Harness Potting Structure With Lightweight Fuse Enclosure
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Solution Overview
Problem
Conventional techniques for covering electronic components with a potting agent result in increased weight due to the thickness of the metal plate required for the potting layer, which is undesirable.
Innovation Solution
A wire harness design incorporating a flexible printed circuit board, a chip fuse, a plate member with a flat plate-shaped body and a cylindrical peripheral wall, and a potting agent, where the plate member is fixed to surround the chip fuse, allowing the potting agent to fill a space portion and cover the fuse, thereby reducing the thickness of the plate member while maintaining the required depth of the potting layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If a metal plate with thickness corresponding to the required depth of the potting layer is used, then the required depth of the potting layer is realized, but the weight of the metal plate increases
Solution Approach 1:
The invention transitions from using a solid thick metal plate to a metal plate with a peripheral wall structure, effectively utilizing the vertical dimension to create depth for the potting layer while keeping the plate body thickness minimal. The peripheral wall protrudes in the thickness direction to form a space that accommodates the potting agent, thus achieving the required depth without increasing the overall plate thickness and weight.
Solution Approach 2:
The invention employs a thin metal plate with a peripheral wall instead of a thick solid plate. The plate body is designed with minimal thickness, and the peripheral wall creates a containment structure for the potting agent, similar to how a thin shell can enclose a volume. This approach reduces the weight of the metal plate while still providing the necessary depth for the potting layer through the peripheral wall structure.
2Weight of stationary object
If the thickness of the plate member is reduced to decrease weight, then the weight of the plate member is reduced, but the depth of the potting layer becomes insufficient
Solution Approach 1:
The invention resolves this contradiction by utilizing the vertical dimension through the peripheral wall that protrudes from the plate body. The plate body itself has reduced thickness for weight reduction, but the peripheral wall extends vertically to create the necessary depth for the potting layer, effectively separating the weight-reduction function (thin plate body) from the depth-provision function (protruding peripheral wall).
Solution Approach 2:
The metal plate is segmented into two functional parts: the plate body for structural support and weight reduction, and the peripheral wall for creating the potting layer depth. This segmentation allows each part to optimize its specific function - the plate body remains thin and lightweight while the peripheral wall provides the necessary vertical space for the potting agent.
Data Source
AI summary
A wire harness includes: a flexible printed circuit board; a chip fuse mounted on the flexible printed circuit board; a plate member having a flat plate-shaped plate body having a frame shape, and a cylindrical peripheral wall protruding from the plate body in a thickness direction of the plate body; and a potting agent, in which the plate body is fixed to the flexible printed circuit board so as to surround the chip fuse by the peripheral wall, and the potting agent is charged in a space portion surrounded by the peripheral wall and covers the chip fuse.