Wire-in-Film Encapsulation for IC Package Miniaturization

Solution Overview

Problem

Conventional semiconductor package structures face challenges in miniaturization, requiring complex and costly manufacturing processes, especially in creating cavities for resin encapsulation, which can damage integrated circuits and increase production complexity.

Innovation Solution

The integrated circuit package system employs a wire-in-film encapsulation with a preformed cavity, eliminating the need for special mold chases and dam structures by using a penetrable film adhesive that is pressed over the integrated circuit and cured, thereby simplifying the manufacturing process and reducing the risk of damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If conventional resin encapsulation with custom mold chase is used to create cavities, then the package can be miniaturized, but the manufacturing process becomes complex and costly

Engineering Contradiction:

Improvepackage sizeVSAvoidmanufacturing process complexity

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The cavity is pre-formed in the wire-in-film encapsulation material before the molding process. This preliminary action eliminates the need for complex custom mold chases during manufacturing, as the cavity structure is already prepared in advance within the encapsulation material itself

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The wire-in-film encapsulation material serves as an intermediary that provides the cavity structure. Instead of using complex mold chases to create cavities, the patent uses this specialized encapsulation material that inherently contains the cavity formation, simplifying the overall manufacturing process

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If custom mold chase is used to form cavity in resin encapsulation, then package miniaturization is achieved, but manufacturing cost increases

Engineering Contradiction:

Improvepackage sizeVSAvoidmanufacturing cost

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The cavity is pre-formed in the wire-in-film encapsulation material before the molding process. This preliminary action eliminates the need for complex custom mold chases during manufacturing, as the cavity structure is already prepared in advance within the encapsulation material itself

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces expensive, complex custom mold chases with a simpler wire-in-film encapsulation material that provides the necessary cavity structure. This substitution uses a more cost-effective material approach rather than investing in specialized tooling

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Volume of moving object

If dam structures are used with planar mold chase to form cavity, then package miniaturization is achieved, but manufacturing steps and complexity increase

Engineering Contradiction:

Improvepackage sizeVSAvoidmanufacturing steps

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The cavity is pre-formed in the wire-in-film encapsulation material before the molding process. This preliminary action eliminates the need for complex custom mold chases during manufacturing, as the cavity structure is already prepared in advance within the encapsulation material itself

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent extracts and removes the complex dam structure requirement from the manufacturing process. By using wire-in-film encapsulation with pre-formed cavities, the need for separate dam structures is eliminated, simplifying the overall manufacturing steps

Inventive Principle:

Principle #2Taking out (Extraction)

4Reliability

If conventional resin encapsulation is used, then package protection is achieved, but reliability is reduced due to potential IC damage during cavity formation

Engineering Contradiction:

Improvepackage reliabilityVSAvoidIC damage risk

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The cavity is pre-formed in the wire-in-film encapsulation material before the molding process. This preliminary action eliminates the need for complex custom mold chases during manufacturing, as the cavity structure is already prepared in advance within the encapsulation material itself

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent converts the potential harm of complex mold chase operations that could damage ICs into a benefit by using wire-in-film encapsulation with pre-formed cavities. This approach eliminates the harmful mechanical stresses and complexities associated with traditional cavity formation methods

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in improved reliability, lower manufacturing costs, and increased yield by simplifying the package design, reducing wire sweep, and eliminating the need for custom mold chases, while maintaining the integrity of the integrated circuit.

Implementation Method 1

curing the wire-in-film encapsulation

Methodology Applied

Scientific EffectCuring:

Data Source

PatentUS8138590B2Integrated circuit package system with wire-in-film encapsulation

Publication Date: 2012.03.20 STATS CHIPPAC LTD

AI summary

An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; preforming a wire-in-film encapsulation having a cavity; pressing the wire-in-film encapsulation over the carrier and the integrated circuit with the cavity exposing a portion of the integrated circuit; and curing the wire-in-film encapsulation.