Wire Link Electrical Testing via Switch Circuit
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Solution Overview
Problem
Existing methods for testing wire links in electronic devices, such as X-ray imaging, do not allow for electrical testing of connections, which is necessary to ensure the integrity and functionality of fragile cables.
Innovation Solution
A device with conductive pads and switch circuits on a chip, where the pads are connected by conductive wires and a conductive track, allowing for electrical testing by controlling and measuring current flow through the switch circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If X-ray imaging is used to test wire links, then the visibility of cables is improved, but the ability to electrically test the cables deteriorates
Solution Approach 1:
The patent introduces an intermediary testing system comprising control circuits, switch circuits, and measurement circuits that mediate between the external testing equipment and the wire links. This intermediary system enables electrical testing by routing test signals through the wire links via the conductive track and switch circuits, thereby resolving the contradiction between visual inspection and electrical testing capabilities
Solution Approach 2:
The patent replaces the mechanical/optical X-ray testing system with an electrical testing system that uses electronic circuits to test wire link integrity. By substituting the mechanical X-ray imaging approach with an electrical measurement approach using voltage signals and measurement circuits, the system achieves both visibility and electrical testing capability
2Reliability
If switch circuits are added to enable electrical testing, then the electrical testing capability is improved, but the device complexity increases
Solution Approach 1:
The conductive track serves multiple functions: it acts as a test signal path during testing operations and as a functional electrical connection during normal device operation. This multi-functionality reduces the need for separate dedicated test structures, thereby limiting the increase in device complexity while maintaining electrical testing capability
Solution Approach 2:
The patent merges the testing functionality with the existing device structure by integrating switch circuits and measurement circuits into the device architecture. The conductive track is combined with the device's existing conductive elements, and the testing operations are merged with normal operational modes, thereby reducing overall complexity compared to having separate dedicated test systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective electrical testing of wire links, ensuring functional connections and detecting damaged cables, thereby improving the reliability of electronic devices.
Implementation Method 1
first conductive pads located on the chip, the conductive pads being coupled to the first conductive elements by conductive wires
Implementation Method 2
a conductive track located on the chip, coupled to each conductive pad by a switch circuit
Data Source
AI summary
An integrated circuit chip is attached to a support that includes first conductive elements. First conductive pads are located on the integrated circuit chip and are electrically coupled to the first conductive elements by conductive wires. The integrated circuit chip further includes a conductive track. A switch circuit is provided to selectively electrically connect each first conductive pad to the conductive track. To test the conductive wires, a group of first conductive pads are connected by their respective switch circuits to the conductive track and current flow between corresponding first conductive elements is measured.