Wire Loop Bonding Strength via Nested Loops
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Solution Overview
Problem
Conventional wire bonding methods often result in inadequate pull strength at the second bonding point due to crescent-shaped wire connections, which can be time-consuming to address through methods like security bonding that involve cutting and re-forming wire balls.
Innovation Solution
A wire bonding method that forms additional wire loops at the extended portion of the wire bonded to the second bonding point without cutting the wire, enhancing the bonding strength by crushing part of the wire and enlarging the bonding area, while also reducing the time required for the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional wire bonding is performed to connect bonding points, then wire connection is achieved, but bonding strength at the second bonding point is inadequate due to crescent-shaped connections
Solution Approach 1:
The invention transforms the harmful crescent-shaped wire connection at the second bonding point into a beneficial configuration by forming an additional wire loop. This loop creates a more favorable stress distribution pattern, converting the geometric disadvantage of the crescent shape into a structural advantage that enhances bonding strength and reliability.
Solution Approach 2:
The invention forms an additional wire loop that is bonded to the second bonding point, creating a nested structure where the wire loops back and bonds again at the same point. This nested configuration increases the effective bonding area and provides redundant bonding paths, thereby enhancing both bonding strength and connection reliability.
2Strength
If security bonding is performed to improve bonding strength by cutting and re-forming wire balls, then bonding strength is enhanced, but processing time is significantly increased
Solution Approach 1:
The invention performs preliminary action by forming the additional wire loop and bonding it to the second bonding point during the normal wire bonding process, before any strength verification is needed. This eliminates the need for subsequent cutting and re-forming operations required in security bonding, thereby enhancing bonding strength without increasing processing time.
Solution Approach 2:
The invention merges the bond strengthening function with the normal wire bonding process by forming the additional loop as an integrated part of the bonding sequence. This combines multiple functions (wire connection and bond strengthening) into a single unified process, eliminating the need for separate security bonding operations and reducing overall processing time.
3Strength
If additional wire loops are formed and bonded to the second bonding point, then bonding strength is enhanced and bonding area is enlarged, but wire loop complexity increases
Solution Approach 1:
The invention segments the wire path into distinct bonding sections by forming an additional loop at the second bonding point. This segmentation creates a dedicated bonding zone that is structurally distinct from the main wire run, allowing the complex bonding reinforcement function to be isolated and integrated without complicating the overall wire loop design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly enhances the bonding strength at the second bonding point and reduces the time needed for wire formation, compared to traditional methods, by creating additional wire loops that increase the bonding area without the need for cutting and re-forming wire balls.
Implementation Method 1
a wire connecting a first bonding point and a second bonding point therethrough, wherein an additional wire loop is formed at an extended portion of the wire wire-bonded to the second bonding point
Implementation Method 2
while part of the wire is crushed
Data Source
AI summary
A wire loop includes a wire connecting a first bonding point and a second bonding point therethrough, wherein an additional wire loop is formed after wire bonding at the second bonding point without cutting the wire and the additional wire loop is bonded to the second bonding point or to the vicinity thereof while part of the wire is crushed.