Wire Loop Height Profiling Using Actual Path Detection
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Solution Overview
Problem
Conventional methods for determining the height of a wire loop in wire bonding operations are unreliable due to variations in the actual path caused by wire sway or lean, leading to inaccurate measurements.
Innovation Solution
An imaging system on a wire bonding machine is used to detect the actual path of the wire loop, allowing for precise determination of height values and profiles by moving a wire bonding tool to contact points along the loop and using detection systems to measure the height at these points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional height measurement techniques are used on wire loops, then measurement can be performed along a desired path, but the actual path variation due to wire sway or lean causes unreliable height measurements
Solution Approach 1:
The imaging system captures images of the wire loop at multiple positions along its path before height measurement begins. These images are used to determine the actual positions and orientations of wire loop segments, allowing the system to compensate for path variations and perform accurate height measurements along the true wire path rather than a desired design path.
Solution Approach 2:
The system uses imaging feedback to continuously monitor the actual position and orientation of the wire loop. This feedback information is fed back into the measurement process to adjust measurement points and calculate heights based on the actual wire configuration, thereby compensating for sway and lean variations that would otherwise compromise measurement reliability.
2Stability of the object's composition
If the wire loop follows a desired design path, then conventional measurement techniques work reliably, but wire sway or lean causes the actual path to deviate from the desired path
Solution Approach 1:
The imaging system captures images of the wire loop at multiple positions along its path before height measurement begins. These images are used to determine the actual positions and orientations of wire loop segments, allowing the system to compensate for path variations and perform accurate height measurements along the true wire path rather than a desired design path.
Solution Approach 2:
The system dynamically adjusts measurement parameters based on the actual wire loop configuration detected by the imaging system. Instead of using fixed measurement points based on a desired path, the system modifies measurement point locations and calculation methods to account for actual wire positions, thereby maintaining manufacturing precision despite path deviations caused by sway or lean.
Data Source
AI summary
A method of determining a height value of a wire loop on a wire bonding machine is provided. The method includes the steps of: (a) imaging at least a portion of a wire loop using an imaging system on a wire bonding machine to detect a path of the portion of the wire loop; (b) moving a wire bonding tool towards a first contact portion of the wire loop in the path; (c) detecting when a portion of a conductive wire engaged with the wire bonding tool contacts the first contact portion of the wire loop; and (d) determining a height value of the wire loop at the first contact portion based on a position of the wire bonding tool when the portion of the conductive wire contacts the first contact portion of the wire loop.