Wire Loop Bonding Sequence from Overlap and Bend Constraints
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Solution Overview
Problem
Conventional methods for determining the sequence of forming multiple wire loops in wire bonding processes are laborious and time-consuming, relying heavily on manual processes and user experience, which hampers productivity and efficiency.
Innovation Solution
An automated method using workpiece data analysis, including position data and wire loop data, to determine the optimal sequence by considering overlap conditions, wire loop heights, lateral bend conditions, and positions, employing directed graph data structures and algorithms to assign the correct bonding order, thereby reducing ambiguity and improving productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual processes and user experience are used to determine wire bond sequences, then expertise-based quality control is achieved, but time consumption and labor intensity increase significantly
Solution Approach 1:
The patent replaces manual mechanical processes with an automated computer-based system that uses algorithms and data structures (directed graphs) to determine wire bond sequences. The system automatically analyzes workpiece data, identifies bonding locations, and generates optimal bonding sequences without human intervention, thereby eliminating time-consuming manual analysis while maintaining or improving accuracy through systematic computational methods
Solution Approach 2:
The system enables self-service by allowing the computer to autonomously determine wire bond sequences using pre-programmed algorithms and directed graph data structures. The automated system independently analyzes workpiece geometry, identifies bonding locations, and generates bonding sequences without requiring external human expertise or manual input, thus reducing both time consumption and labor intensity while maintaining determination accuracy
2Productivity
If automated algorithms and directed graph data structures are used to determine wire bond sequences, then productivity and efficiency are enhanced, but system complexity increases
Solution Approach 1:
The patent segments the complex task of wire bond sequence determination into distinct computational components: (1) data input module for receiving workpiece data, (2) processing module for analyzing bonding locations and generating sequences using directed graph algorithms, and (3) output module for providing the determined sequence. This segmentation manages system complexity by organizing functions into modular, independent units that can be developed and maintained separately while collectively achieving high productivity
Solution Approach 2:
The patent introduces directed graph data structures as an intermediary representation layer between the raw workpiece data and the final bonding sequence output. The directed graphs serve as a mathematical model that abstracts the complex relationships between bonding locations, enabling the system to process and analyze wire bond configurations efficiently without requiring complex physical manipulation or manual intervention, thus enhancing productivity while managing computational complexity
Data Source
AI summary
A method of determining a sequence for creating a plurality of wire loops is provided. The method includes (a) providing workpiece data for a workpiece. The workpiece data includes (i) position data for bonding locations of the workpiece, and (ii) wire loop data for a plurality of wire loops providing interconnection between ones of the bonding locations. The method also includes (b) analyzing the workpiece data. The step of analyzing includes considering overlap conditions between ones of the plurality of wire loops, considering wire loop heights of ones of the plurality of wire loops, considering lateral bend conditions between ones of the plurality of wire loops, and considering wire loop positions for ones of the plurality of wire loops. The method also includes (c) providing a sequence of creating the plurality of wire loops in connection with the workpiece at least partially based on the results of step (b).