Automated Wire Loop Parameter Optimization in Semiconductor Packaging
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Solution Overview
Problem
Conventional wire bonding systems rely on manual input of looping parameters, leading to a time-consuming and error-prone process for optimizing wire loop trajectory in semiconductor packaging, which lacks precision and efficiency.
Innovation Solution
A method where package data and looping control values are used to derive optimized looping parameters through an algorithm, allowing for iterative adjustments until actual control values meet specified tolerances, thereby automating the optimization of wire loop formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual input of looping parameters is used, then the wire bonding process can be performed, but the process is time-consuming and error-prone
Solution Approach 1:
The patent replaces the manual mechanical input process with an automated computer-based system. The wire bonding machine includes a computer that automatically determines looping parameters by receiving package data and looping control values, then calculating optimal parameters using algorithms, eliminating the need for manual parameter entry and optimization.
Solution Approach 2:
The wire bonding machine performs self-optimization of looping parameters through its integrated computer system. The machine automatically adjusts parameters based on received control values and package data without requiring external manual intervention, making the system self-sufficient in parameter optimization.
2Ease of operation
If manual input of looping parameters is used, then the wire bonding process can be performed, but human error increases
Solution Approach 1:
The patent replaces manual parameter input with an automated computer-based determination system. The computer receives package data and looping control values, then automatically calculates optimal looping parameters using algorithms, eliminating human error associated with manual parameter entry and optimization.
Solution Approach 2:
The system incorporates feedback mechanisms where the computer receives looping control values that specify desired wire loop characteristics, processes this information along with package data, and automatically adjusts looping parameters to achieve the desired outcomes, ensuring high reliability and accuracy.
3Productivity
If automated parameter determination is implemented, then time consumption and errors are reduced, but system complexity increases
Solution Approach 1:
The wire bonding machine is designed with multi-functionality, integrating both the wire bonding capability and the automated parameter determination system within a single device. The computer serves multiple functions including receiving package data, processing looping control values, calculating optimal parameters, and controlling the bonding process, thereby managing complexity through functional integration.
Data Source
AI summary
A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).