Semiconductor Package Wire Loop Tolerance for Component Placement Shift
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Inaccurate placement of electronic components in semiconductor packages can adversely affect wire loops, leading to issues such as short circuits and clearance problems, which impact manufacturing yield and performance.
Innovation Solution
Simulate electronic component placement variations using software tools to determine the effects on wire loops, assess acceptable levels of shift and rotation, and optimize component positions to improve package design and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are placed with high precision, then wire loop interference and short circuiting are reduced, but manufacturing complexity and cost increase
Solution Approach 1:
The patent performs preliminary simulation of component placement variations using software tools before actual manufacturing. This allows the design to be optimized in advance for placement tolerances, determining acceptable levels of shift and rotation that will not cause wire loop interference, thereby reducing the need for ultra-precise placement during manufacturing.
Solution Approach 2:
The patent changes the approach from controlling placement precision directly to simulating placement variations and determining acceptable parameter ranges. By modeling the effects of placement variations on wire loops and identifying tolerance thresholds, the system transforms a precision control problem into a tolerance specification problem, simplifying the manufacturing process.
2Productivity
If placement tolerance specifications are established through simulation, then development time is reduced, but computational resources and time for simulation increase
Solution Approach 1:
The patent performs placement variation simulations during the design phase before manufacturing begins. By pre-determining acceptable placement tolerances through simulation, the system eliminates the need for time-consuming trial-and-error adjustments during production, accelerating the overall development cycle despite the initial simulation time investment.
Solution Approach 2:
The patent creates a virtual copy of the semiconductor package design in simulation software, allowing repeated testing of placement variations without physical prototyping. This virtual modeling approach replaces time-consuming physical trial assemblies, enabling rapid determination of placement tolerances and acceleration of the development process.
Data Source
AI summary
A method of determining an effect of electronic component placement accuracy on wire loops in a semiconductor package is provided. The method includes the steps of: (a) providing package data for a semiconductor package, the semiconductor package including an electronic component; (b) simulating placement of the electronic component in a plurality of positions with respect to a substrate in the semiconductor package; and (c) determining, using a software tool, an effect of each of the plurality of positions of the electronic component on a plurality of wire loops included in the semiconductor package.