Wire Connection to Metalized Plastic Circuit Paths
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Solution Overview
Problem
Existing methods for connecting wires to circuits in 3D molded interconnect devices, such as the laser direct structuring process, face challenges in achieving a secure and reliable electrical connection on plastic bases.
Innovation Solution
A process involving the formation of electrically conductive paths on a plastic base using metal foil, where a cover with blade features and a metal pill is used to press a non-insulated wire section into a metalized channel, and an elastomeric cover with a metal pill completes the circuit when depressed, enhancing the attachment and connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wire is connected to a metalized circuit path on a plastic part using existing methods, then the electrical connection can be established, but the connection reliability and security are insufficient
Solution Approach 1:
The patent applies preliminary action by pre-stripping the insulation from a section of the wire before insertion, and by pre-forming the metalized channel and contact pads on the plastic substrate. The assembly process then simply requires inserting the prepared wire into the molded cavity and securing it with a snap-fit mechanism, eliminating complex post-assembly connection steps and improving reliability without significantly increasing manufacturing complexity.
Solution Approach 2:
The patent uses an intermediary approach by introducing a metalized channel and contact pad system as an intermediate connection interface between the wire and the circuit. This metalized pathway on the plastic substrate acts as a mediator that provides both mechanical support and electrical conductivity, enabling reliable connections while simplifying the overall assembly process.
2Manufacturing precision
If the wire insulation is removed to expose the conductor, then electrical contact can be made with the metalized channel, but the wire may shift or become misaligned during assembly
Solution Approach 1:
The patent applies preliminary action by pre-stripping the insulation from a specific section of the wire to expose the conductor, and by pre-forming the metalized channel and contact pads on the plastic substrate during the molding process. This preparation ensures that when the wire is inserted, the exposed conductor aligns precisely with the metalized contact area, eliminating positioning errors without requiring complex alignment mechanisms.
Solution Approach 2:
The patent utilizes visual differentiation (analogous to color changes) by making the metalized channel and contact pads visually distinct from the surrounding plastic substrate through selective metalization. This visual contrast provides immediate feedback during assembly, allowing operators to verify correct wire insertion and alignment, thereby ensuring manufacturing precision without adding mechanical complexity.
3Stability of the object's composition
If a secure mechanical attachment is used to hold the wire in place, then connection stability improves, but the assembly process becomes more complex
Solution Approach 1:
The patent merges the mechanical attachment function with the electrical connection function by integrating the wire retention mechanism directly into the molded plastic housing. The snap-fit features and retaining structures are formed as part of the single molded component that also contains the metalized circuit paths, eliminating the need for separate mechanical fasteners and simplifying the assembly process while ensuring connection stability.
Solution Approach 2:
The patent applies self-service by designing the molded housing to automatically secure the wire through integrated snap-fit features and retaining structures that engage with the wire or its insulation. This self-securing mechanism eliminates the need for additional fasteners or complex assembly steps, allowing the wire to be held firmly in place simply by the structural design of the housing itself, thereby maintaining ease of operation while ensuring connection stability.
Data Source
AI summary
A method and apparatus for connecting wires to circuits, including the formation of at least one electrically conductive path having a plastic base with a metal foil formed of laser direct processes.