Wire-on-lead Package with Peripheral Paddle Extensions
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Solution Overview
Problem
Conventional semiconductor package systems face challenges in accommodating larger semiconductor dies without compromising package reliability and increasing manufacturing costs, particularly in achieving miniaturization and high I/O density for portable devices.
Innovation Solution
The implementation of a wire-on-lead package system that includes a die attach paddle with paddle extensions distributed along its periphery, surrounded by leadfingers, allowing bond wires to connect the semiconductor die to both the leadfingers and paddle extensions, enabling larger semiconductor dies to be used while maintaining electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional semiconductor package structures are used with standard leadframe configurations, then manufacturing processes are well-established and reliable, but the package size cannot be sufficiently minimized and I/O density is limited
Solution Approach 1:
The leadframe is segmented into distinct functional zones: an active area with leadfingers for I/O connections, a die attach area for mounting the semiconductor die, and intermediate transition zones. This segmentation allows each area to be optimized independently, enabling miniaturization while maintaining manufacturing simplicity through standardized processes.
Solution Approach 2:
The leadframe structure serves multiple functions simultaneously: it provides mechanical support, electrical connections through leadfingers, die attachment surface, and defines the package footprint. The integrated design eliminates the need for separate components, reducing overall package size while maintaining established manufacturing reliability.
2Quantity of substance
If larger semiconductor dies are used to increase functionality, then more circuit elements can be integrated, but the package size increases and miniaturization goals are compromised
Solution Approach 1:
The leadframe utilizes two-dimensional space efficiently by arranging leadfingers in radial patterns around the die attach area and extending contact points to the periphery. This dimensional optimization allows larger die with more circuit elements to be accommodated within a minimized package footprint by maximizing the use of available planar space.
3Productivity
If the number of I/O connections is increased for higher density, then more bond wires are required, but the package area available for connections is limited
Solution Approach 1:
The leadframe implements local quality optimization by concentrating multiple leadfinger contact points in specific high-density zones around the die periphery, while maintaining larger spacing in areas requiring mechanical stability. This localized optimization enables high I/O density in critical regions without compromising overall package integrity or requiring excessive total area.
Data Source
AI summary
A method of manufacture of a wire-on-lead package system includes: providing a die attach paddle with paddle extensions distributed along the periphery of the die attach paddle, providing leadfingers surrounding the die attach paddle, attaching a semiconductor die to the die attach paddle wherein the semiconductor die is larger than the die attach paddle, and connecting bond wires between the semiconductor die and the leadfingers and between the semiconductor die and the paddle extensions.