Wire Overmold Device Positioning and Protection

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Solution Overview

Problem

In automotive applications, existing wire overmold technologies fail to securely position and hold wires during the molding process, leading to potential damage and limited configuration options, which increases manufacturing costs and time.

Innovation Solution

A wire overmold device comprising a carrier body and a wire cap that securely encloses and positions wires, with the wire cap and carrier body protruding from the overmold, ensuring consistent and repeatable placement during molding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If wires are not securely held in position during overmolding, then wire positioning flexibility is improved, but wire damage risk increases and manufacturing reliability deteriorates

Engineering Contradiction:
Improvewire positioning flexibilityVSAvoidwire damage risk
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The wire positioning device is pre-assembled with the carrier body and wire cap before the overmolding process. This preliminary positioning ensures wires are securely held in desired positions before molding begins, preventing wire damage while maintaining positioning flexibility through adjustable device design.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

A wire positioning device acts as an intermediary component between the carrier body and wire cap, providing secure wire positioning during overmolding. This mediator device allows wires to be held reliably while still permitting configuration changes by adjusting the positioning device structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If wires are securely held in position during overmolding, then manufacturing reliability is improved, but device complexity increases

Engineering Contradiction:
Improvewire positioning reliabilityVSAvoidpositioning device structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The wire positioning device merges the carrier body and wire cap into a single integrated assembly. This combination reduces device complexity by eliminating separate positioning mechanisms while maintaining reliable wire positioning through the unified structure that holds wires securely during overmolding.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The wire positioning device serves multiple functions: it holds wires in position, provides structural support, and enables configuration adjustments. This multi-functionality reduces the need for additional specialized components, thereby reducing overall device complexity while maintaining positioning reliability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If wire positioning is flexible, then design adaptability is improved, but manufacturing precision deteriorates

Engineering Contradiction:
Improvewire configuration optionsVSAvoidwire placement consistency
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The wire positioning device allows parameter changes in wire configuration (such as position, angle, and spacing) while maintaining manufacturing precision through adjustable but fixed positioning features. These features enable design adaptability while ensuring consistent wire placement during the overmolding process.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS10218164B2Method of forming wire overmold device
Publication Date: 2019.02.26 SUZHOU LITTELFUSE OVS LTD
  • US10218164B2 patent drawing
  • US10218164B2 patent drawing
  • US10218164B2 patent drawing

AI summary

A wire overmold device including a carrier body having a distal end and a proximal end, a wire cap configured to engage the distal end of the carrier body, at least one of a jacketed cable and one or more wires at least partially enclosed between the wire cap and the carrier body, and an overmold formed over the proximal end of the carrier body and at least portions of the wire cap and the distal end of the carrier body, wherein the wire cap and the distal end of the carrier body protrude from the overmold.