Wire-Penetrating Force Sensor for Robot Miniaturization

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Solution Overview

Problem

Existing force measuring sensors in robots are complex in structure, difficult to miniaturize, and costly due to their metal or plastic composition and additional structural components, with frequent contact defects arising from different materials used for electrodes and dielectric materials.

Innovation Solution

A force measuring sensor with a simplified structure, featuring a wire penetrating an internal space within a signal generating part, where an analog signal is generated by changes in the thickness of a dielectric layer caused by tension changes, and processed into a digital signal using a PCB with integrated electrodes and a dielectric layer, reducing the need for separate fixing members and substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a force measuring sensor is made of metal or plastic with additional structures for connecting wire and sensor, then the sensor has sufficient strength and connectivity, but the sensor becomes complicated in structure and difficult to miniaturize

Engineering Contradiction:
Improvesensor structureVSAvoidsensor strength
Core Design Contradiction:
Device complexityVSStrength

Solution Approach 1:

The patent merges the wire and sensor into a single integrated structure where the wire itself forms part of the sensor assembly. The wire is directly connected to the electrode without additional connecting structures, eliminating the need for separate fixing members and substrates. This integration simplifies the overall sensor structure while maintaining mechanical strength and electrical connectivity through the unified design.

Inventive Principle:
Principle #5Merging (Combining)

2Ease of manufacture

If additional structures are provided to connect wire and force measuring sensor, then connectivity is ensured, but manufacturing costs increase due to multiple substrates and circuits

Engineering Contradiction:
Improvemanufacturing costVSAvoidsensor structure
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the unnecessary additional structures (separate substrates and connecting circuits) from the sensor assembly. By removing these extraneous components and retaining only the essential wire-sensor integration, the manufacturing process is simplified and costs are reduced while maintaining the core functionality of the sensor.

Inventive Principle:
Principle #2Taking out (Extraction)

3Reliability

If dielectric material and electrodes are made of materials different from circuit materials, then electrical connection is achieved, but contact defects occur frequently

Engineering Contradiction:
Improvecontact stabilityVSAvoidmaterial compatibility
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies homogeneity by making the dielectric layer, electrode, and circuit board material consistent - all are formed using the same conductive filler and resin composition. This material uniformity eliminates interface incompatibility issues between different materials, reducing contact defects and improving reliability. The electrode and circuit board are essentially made of the same material system, ensuring stable electrical connection without material mismatch problems.

Inventive Principle:
Principle #33Homogeneity

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables miniaturization, reduces manufacturing costs, and enhances the sensor's performance and stability by directly integrating the wire with the signal generating part and using a conductive filler and resin dielectric layer for increased sensitivity.

Implementation Method 1

the analog signal is generated by a change in thickness of a component of the signal generating part caused by a change in tension of the wire

Methodology Applied
Scientific EffectCapacitance: Capacitance

Implementation Method 2

A pressing force applied to the dielectric layer by the plate may be changed by the change in tension of the wire, and a thickness of the dielectric layer may be changed by the change in pressing force

Methodology Applied
Scientific EffectPiezoelectric Effect: Piezoelectric Effect

Data Source

PatentUS11858120B2Force measuring sensor and robot including same
Publication Date: 2024.01.02 HYUNDAI MOTOR CO LTD
  • US11858120B2 patent drawing
  • US11858120B2 patent drawing
  • US11858120B2 patent drawing

AI summary

A force measuring sensor is provided. The force measuring sensor includes: a wire; a signal generator having one side fixed to one end of the wire; and a signal processor configured to convert and process an analog signal received from the signal generator into a digital signal, in which the wire is configured to penetrate an internal space formed in the signal generator, and the analog signal is generated by a change in thickness of a component of the signal generator caused by a change in tension of the wire.