High-Friction Wire Processing Tray for Bundle Linearity
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Solution Overview
Problem
Automated wire processing machines face challenges in managing long wire bundles, leading to wire entanglement during processing and removal due to insufficient methods to maintain wire linearity and separation.
Innovation Solution
A wire processing system with a tray surface featuring a higher wire-to-surface coefficient of friction compared to wire-to-wire friction, combined with a loop puller mechanism and separator devices, to prevent wire entanglement by restricting wire movement and promoting linearity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If automated wire processing machines process long wire bundles, then productivity increases, but wire entanglement occurs during processing and removal
Solution Approach 1:
The patent introduces a tray with a high-friction surface as an intermediary between the wire processing machine and the wire bundles. This tray mediates the interaction by providing a surface that grips the wires firmly, preventing them from tangling during automated processing and removal operations.
Solution Approach 2:
The patent changes the friction parameter of the tray surface to be higher than the wire-to-wire friction coefficient. This parameter change ensures that the wires remain stationary relative to the tray while allowing controlled movement during processing, thereby preventing entanglement while maintaining productivity.
2Stability of the object's composition
If wires are laid sequentially on a tray, then wire linearity can be maintained, but wire movement relative to each other may cause entanglement
Solution Approach 1:
The patent changes the friction parameter of the tray surface to be higher than the wire-to-wire friction coefficient. This ensures that when wires are laid sequentially, they remain fixed relative to the tray while maintaining linearity, preventing entanglement during subsequent processing operations.
3Loss of time
If wire bundles are removed from the processing machine, then production cycle completes, but wire entanglement occurs during removal
Solution Approach 1:
The high-friction tray acts as an intermediary that maintains wire separation and linearity throughout the production cycle, including during removal. The tray's surface properties ensure wires are held firmly in place during processing and facilitate clean removal without entanglement, reducing production cycle time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively reduces wire entanglement and allows for the automated assembly of long wire bundles by maintaining wire linearity and separation, facilitating efficient processing and removal.
Implementation Method 1
The tray surface has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire
Data Source
Figure 1
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AI summary
A wire processing system (100) includes a tray having at least one tray surface (378) configured to sequentially receive a first wire (200) and a second wire (204) from a wire feed system (106) of a wire processing machine (102). The tray surface (378) has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface (378) and the first wire (200) higher than a wire-to-wire coefficient of friction between the first wire (200) and the second wire (204) laying on top of the first wire (200). The wire-to-surface coefficient of friction reduces movement of at least a portion of the first wire (200) relative to the tray surface (378) during movement of the second wire (204) relative to the first wire (200).