Wire Saw Extraction Speed Control for Wafer Surface Quality
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Solution Overview
Problem
The existing wire saw technology generates saw marks and warp on semiconductor wafers due to slurry residue during the extraction process, leading to quality degradation, and attempts to stop wire travel result in wire disconnection.
Innovation Solution
Control the wire saw to travel at a speed of 2 m/min or less during workpiece extraction, with both forward and backward traveling distances of 1 m or less, and adjust the slurry temperature to be higher than at the end of slicing to prevent saw marks and wire disconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the wire saw travels at high speed during workpiece extraction, then productivity is improved, but saw marks and warp are generated on the wafer surface due to slurry residue
Solution Approach 1:
The patent applies parameter changes by controlling the wire travel speed to 2 m/min or less during workpiece extraction. This speed reduction prevents slurry residue from being smeared onto the wafer surface, thereby eliminating saw marks and warp while still maintaining productive extraction operations.
2Manufacturing precision
If the wire saw stops traveling during workpiece extraction to prevent saw marks, then manufacturing precision is improved, but wire disconnection occurs
Solution Approach 1:
The patent resolves this contradiction by changing the wire travel speed parameter to a low but non-zero value (2 m/min or less). This maintains wire tension and prevents disconnection while sufficiently reducing the speed to prevent slurry smearing and associated surface defects.
3Stress or pressure
If the slurry temperature is increased during extraction, then slurry viscosity decreases and flow improves, but wire tension may be affected
Solution Approach 1:
The patent applies parameter changes by adjusting the slurry temperature during extraction. The heated slurry reduces in viscosity and flows more easily, preventing residue accumulation on the wafer surface while the controlled wire speed maintains adequate tension.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces saw marks and warp on wafers without causing wire disconnection, allowing for smooth extraction of workpieces without damaging the slicing surface.
Implementation Method 1
a wire (a high-tensile steel wire) to travel at a high speed, presses a workpiece against the wire to cut the workpiece while applying a slurry to the wire
Data Source
AI summary
The present invention is a wire saw in which a wire for slicing is wound around a plurality of rollers to form a wire row; the wire for slicing is driven axially in a reciprocating direction; a workpiece is sliced simultaneously at a plurality of points arranged in an axial direction by feeding the workpiece against the wire row with the workpiece cut into while a slurry is supplied to the wire for slicing; the wire saw controlling in such a manner that the workpiece is extracted while the wire is caused to travel at a speed of 2 m/min or less at the time of extracting the workpiece from the wire row after slicing the workpiece. As a result, there is provided a wire saw in which the workpiece sliced with the wire row of the wire saw can be extracted from the wire row with a simple structure without a negative influence on its slicing surface.