Wire Saw Slurry Blocking Plate for Wafer Surface Quality
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Solution Overview
Problem
Conventional wire saw devices for cutting wafers from silicon ingots or compound semiconductor materials suffer from slurry splashing onto the work surface, leading to increased nanotopography and Warp, which deteriorate the quality of the wafers, and existing solutions either complicate the device structure or are costly.
Innovation Solution
A wire saw device with a pivotably fixed slurry blocking plate that falls onto the work surface, preventing slurry from splashing and maintaining contact during cutting, and optionally using dual nozzles for slurry supply, with the blocking plate designed to be flexible and composed of multiple pieces for enhanced adhesion and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If slurry is supplied to the wires during cutting, then cutting efficiency is improved, but slurry splashes onto the work surface causing nanotopography increase and quality deterioration
Solution Approach 1:
A slurry blocking plate is introduced as an intermediary component between the slurry supply source and the work surface. The plate blocks and redirects slurry flow to prevent direct contact with the work surface, thereby maintaining cutting efficiency while preventing quality deterioration from slurry contamination.
Solution Approach 2:
The slurry blocking plate creates a localized protective zone over the work surface. Instead of modifying the entire system, the solution applies a localized barrier precisely where slurry contamination occurs, allowing slurry to effectively cool and cut the wires while preventing surface contamination.
2Manufacturing precision
If a slurry blocking plate is added to prevent slurry splashing, then wafer quality is improved, but device complexity increases
Solution Approach 1:
The slurry blocking plate is divided into multiple segments or pieces rather than being a single monolithic structure. This segmentation allows the plate to flex and adapt to the work surface contour, improving effectiveness while simplifying the overall structure and enabling easier installation and maintenance.
Solution Approach 2:
The slurry blocking plate is designed with flexibility to dynamically adapt to the work surface. Rather than being a rigid fixed structure, the plate can flex and conform to the curved surface of the work, maintaining optimal blocking position throughout the cutting process without requiring complex adjustment mechanisms.
3Manufacturing precision
If the slurry blocking plate is made flexible to maintain contact with work surface, then slurry blocking effectiveness is improved, but plate strength and durability may be compromised
Solution Approach 1:
The slurry blocking plate utilizes flexible materials that can conform to the work surface while maintaining sufficient structural integrity. The flexible plate design allows it to bend and adapt to surface contours without breaking, while the material selection ensures it doesn't deform permanently under operational stresses.
Solution Approach 2:
The slurry blocking plate employs composite material construction combining flexible elements with reinforcing structures. This allows the plate to exhibit both flexibility for surface conformity and sufficient strength for durability, integrating the benefits of multiple materials to overcome the limitations of single-material designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively suppresses slurry splashing and associated nanotopography and Warp, maintaining wafer quality while keeping the device structure simple and cost-effective.
Implementation Method 1
a slurry blocking plate extending in a direction along which a group of multiple wires are aligned in parallel to one another and pivotally fixed at a base point above the multiple wires so as to fall on the work in a direction of pushing the work with respect to the multiple wires
Implementation Method 2
pivotally fixed at a base point above the multiple wires so as to fall on the work in a direction of pushing the work
Data Source
AI summary
An object of the present invention is to provide at a relatively cheap price a wire saw device capable of effectively preventing slurry from splashing onto the top surface of a work and effectively suppressing increase in nanotopography and Warp. The wire saw device 1 of the present invention has: a group of multiple wires 4 formed by suspending a wire 3 over a set of rollers 2, 2, 2 separate from each other so as to be aligned in a cutting side thereof in parallel to one another in the roller shaft direction X and capable of running in a direction orthogonal to the roller shaft direction; a work holding portion 5 for holding a work W and moving the work W in a direction of pushing the work W with respect to the group of multiple wires 4; and a nozzle 6 for supplying slurry to the group of multiple wires 4 from at least a position on the upperstream side in the running direction of the multiple wires 4, with respect to a path along which the work W is pushed into the wire 3. Further, the wire saw device 1 is provided with a slurry blocking plate 7, extending in the direction along which the multiple wires 4 are aligned in parallel to one another, and pivotably fixed at a base point located at least on the side at which the nozzle 6 is provided and above the multiple wires 4, such that the slurry blocking plate 7 falls, around the base point, on the work W in the direction of pushing the work W with respect to the multiple wires 4.