Wire Saw Slurry Splash Blocking for Wafer Warp Reduction
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Solution Overview
Problem
The existing wire saw apparatuses generate significant warp in sliced wafers, particularly near the end faces, due to slurry splashing and accumulation, leading to bellows motion and vibration during the slicing process.
Innovation Solution
Incorporating plate-shaped or block-shaped slurry-splash-blocking members arranged perpendicular to the wire direction below the work-holding portion on both the wire cut-in and cut-out sides to prevent slurry from splashing upward and accumulating, thereby reducing the bellows motion and improving warp quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If slurry is supplied to the wire during slicing, then slicing efficiency is improved, but slurry splashes and accumulates causing bellows motion and warp degradation
Solution Approach 1:
The harmful splashing slurry is extracted and removed from the system by introducing slurry splash blocking members that intercept and contain the splashing slurry, preventing it from reaching the workpiece and causing bellows motion
Solution Approach 2:
Slurry splash blocking members are introduced as intermediary elements between the wire and the workpiece to intercept the splashing slurry, acting as a mediator that prevents direct contact between the harmful slurry and the workpiece surface
2Speed
If the wire travels at high speed in reciprocating direction, then slicing speed is improved, but slurry splashing and bellows motion increase causing vibration
Solution Approach 1:
Slurry splash blocking members are positioned in advance to preemptively block the path of splashing slurry before it can reach the workpiece, preventing the bellows motion and vibration that would result from slurry accumulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses slurry splashing and accumulation, reducing the bellows motion and significantly improving the warp shape of sliced wafers, especially in the last half of the slicing process, by preventing slurry from adhering and vibrating during the cutting process.
Implementation Method 1
the wire 102 is caused to travel in a reciprocating direction by the driving motor 110
Implementation Method 2
an appropriate tensile force is applied to the wire 102 by the tensile-force-giving mechanism 104
Implementation Method 3
a work-feeding mechanism which feeds a work to be sliced toward the wire by holding and pushing down the work
Implementation Method 4
a nozzle for supplying a slurry to the wire; and a work-feeding mechanism which feeds a work to be sliced toward the wire by holding and pushing down the work, and slicing the work into wafers by pressing and feeding the work held by the work-feeding mechanism against the wire traveling in a reciprocating direction with the work cut into while a slurry is supplied to the wire through the nozzle
Data Source
AI summary
A wire saw apparatus having: a wire wound around grooved rollers and axially travels in a reciprocating direction; a nozzle for supplying a slurry; and a work-feeding mechanism feeding a work toward the wire, and slicing into wafers by pressing and feeding the work against the wire traveling in a reciprocating direction while a slurry is supplied to the wire through the nozzle. A work-holding portion holds the work through a pad plate adhered to the work and a work plate, plate-shaped or block-shaped slurry-splash-blocking members are arranged in the direction of a right angle to a row of the wire wound around the grooved rollers below the work-holding portion and on both the wire cut-in side and a wire cut-out side.