Wire Soldered Structure via Through-Hole for Compact PCBs
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Solution Overview
Problem
Conventional methods for soldering coaxial cables or wires to circuit boards face challenges due to insufficient bonding pad area, leading to increased heat conduction paths, overheating, and potential short circuits, especially in compact electronic devices where the diameter of coaxial cables and circuit boards are reduced.
Innovation Solution
A wire soldered structure featuring a substrate with a through hole and a soldered wire portion adjacent to the hole, where the wire is soldered to the substrate via a solder or preset solder, ensuring reliable bonding and minimizing overheating risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding pad area is increased to accommodate more coaxial cables or wires, then the soldering reliability is improved, but the device size increases
Solution Approach 1:
The patent introduces a through-hole dimension垂直 to the substrate surface, transforming the traditional planar bonding pad configuration into a three-dimensional structure. The wire passes through the through-hole and is soldered to bonding pads on both the front and back surfaces of the substrate, effectively utilizing the vertical dimension to achieve reliable electrical connection without increasing the lateral footprint of the device.
2Area of stationary object
If the diameter of coaxial cable is reduced to accommodate smaller device size, then the device size is reduced, but the heat conduction path length increases causing soldering failure
Solution Approach 1:
The patent segments the soldering process into two distinct locations: the front surface bonding pad and the back surface bonding pad. This segmentation allows the heat conduction path to be divided into two shorter paths, each extending from the respective bonding pad to the wire, rather than requiring a single long path through the entire substrate thickness. This reduces the total heat conduction distance and improves thermal management during soldering.
Solution Approach 2:
The wire itself acts as an intermediary thermal conduction path. By passing the wire through the substrate and making contact with bonding pads on both surfaces, the wire provides a direct thermal bridge that facilitates more efficient heat transfer during the soldering process, reducing the risk of soldering failure even with reduced cable diameter.
3Manufacturing precision
If the soldering torch is applied for a long period to ensure proper soldering, then the soldering completeness is improved, but the insulating layer is melted causing short circuit
Solution Approach 1:
The segmented soldering approach allows each bonding pad to be soldered separately or simultaneously for a shorter duration. Since the wire is in direct contact with both bonding pads, the thermal mass is distributed, and the required soldering time for each location is reduced compared to a single long-duration soldering process. This minimizes the risk of overheating and melting the insulating layer.
4Ease of operation
If the space between coaxial cables is increased to provide enough bonding pad area, then the soldering accessibility is improved, but the device size increases
Solution Approach 1:
By utilizing the vertical dimension through the through-hole configuration, the patent allows wires to be densely packed in the lateral direction without compromising soldering accessibility. The soldering torch can access the bonding pads on the front surface, and the wire's extension through the substrate provides inherent spacing and positioning, eliminating the need for large lateral gaps between adjacent wire assemblies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability of the soldered connection between wires and the substrate, preventing overheating and short circuits while accommodating smaller device sizes.
Implementation Method 1
a heat conduction path and time for heating will be increased, resulting in a failure of the soldered process
Implementation Method 2
the soldered portion of the wire is soldered to the first conducting layer of the substrate via the solder
Data Source
AI summary
A wire soldered structure includes a substrate including a main body, a first conducting layer disposed on the main body, and a through hole extending through the main body and the first conducting layer; a wire including a soldered portion that is disposed on the first conducting layer and that is adjacent to the through hole; and a solder disposed in the through hole; wherein the soldered portion of the wire is soldered to the first conducting layer of the substrate via the solder.