Conductor Wire Soldering With Half-Stripping for Narrow-Pitch Electrodes
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Solution Overview
Problem
Existing methods for soldering conductor wires to electrodes on substrates with narrow pitch face challenges such as conductor bending and require excessive solder thickness due to insulation coating gaps, leading to unreliable connections.
Innovation Solution
A conductor wire connection method involving tension application, partial exposure using a half-stripping jig with comb-shaped elements, and a heating element for secure soldering, ensuring conductor wires are pressed against electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If tension is applied to the conductor wire during soldering, then the conductor wire bending is reduced and soldering reliability is improved, but the conductor wire may break or the insulation coating may be damaged
Solution Approach 1:
The method applies tension to the conductor wire before soldering to prevent bending during the soldering process. By establishing the proper wire position and tension state beforehand, the conductor remains straight and properly positioned throughout soldering, ensuring reliable connections without requiring excessive force during the actual soldering operation.
Solution Approach 2:
The method controls the tension parameter within a specific range during soldering. By adjusting and maintaining tension at appropriate levels (not too high to cause breakage, not too low to allow bending), the process achieves reliable soldering while protecting the conductor wire integrity. The tension is applied selectively during the soldering operation rather than continuously.
2Ease of manufacture
If the insulation coating is removed completely to expose the conductor wire, then soldering access is improved, but the conductor wire becomes vulnerable to damage and the process complexity increases
Solution Approach 1:
Instead of completely removing the insulation coating, the method applies partial action by removing only the necessary portion of insulation to expose the conductor wire tip for soldering. This partial removal provides sufficient access for reliable soldering while leaving the majority of the insulation coating intact to protect the conductor wire from damage and maintain its structural integrity.
Solution Approach 2:
The insulation removal is applied locally only at the tip area where soldering is required, rather than along the entire length of the conductor wire. This localized approach provides the necessary soldering access at the connection point while preserving the protective insulation coating elsewhere, thus protecting the conductor wire from unnecessary exposure and damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy and reliable soldering of conductor wires to electrodes, reducing bending issues and allowing for efficient connection without damaging the wires or substrate.
Implementation Method 1
soldering the conductor wire to the electrode while the conductor wire is pressed toward the substrate by a heating element
Data Source
AI summary
A method for connecting a conductor wire to an electrode that is formed on a substrate includes placing the conductor wire on the electrode while tension is applied to the conductor wire, and soldering the conductor wire to the electrode while the conductor wire is pressed toward the substrate by a heating element.