Wire Splicing Device Segmented Heating Pressing Plate
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Solution Overview
Problem
Existing wire connection devices require lengthy heating and cooling cycles, leading to poor production efficiency and potential deterioration of superconducting wires due to excessive heat exposure, which affects the stability and performance of the connection.
Innovation Solution
A wire splicing device with a separate pressing plate and heating body, driven by air cylinders, allows for controlled heating and immediate stopping of heat application, reducing the time needed to solidify solder and minimizing heat exposure to the wires, thereby enhancing production efficiency and maintaining the integrity of superconducting properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the heating member is used to heat and press the wires together, then the solder is melted to connect the superconducting wires, but the heating member needs to be cooled down to solidify the solder, resulting in long connection time
Solution Approach 1:
The device is divided into separate pressing and heating functions. The pressing plate applies pressure to the wires while the heating body applies heat through the pressing plate. This segmentation allows the heating body to be removed after heating, while the pressing plate remains to maintain pressure during cooling, eliminating the need to cool the entire heating assembly.
Solution Approach 2:
The heating body is extracted as a separate removable component from the pressing mechanism. After the heating process is complete, the heating body can be taken out or removed from the pressing plate, allowing the pressing plate to continue applying pressure while the heated area cools down, significantly reducing the cooling time required.
2Productivity
If the heating member is continuously used for multiple connection operations, then heating can be maintained, but the heating member requires re-heating time between operations, reducing production efficiency
Solution Approach 1:
The heating body is pre-heated to the required temperature before the connection operation begins. Since the heating body can be removed after heating and the pressing plate maintains pressure during cooling, the system is ready for the next operation immediately after placing new wires, eliminating re-heating time and enabling continuous high-speed production.
3Manufacturing precision
If excessive heat is applied to the wires during connection, then the solder melts properly, but the superconducting wires may deteriorate, affecting connection stability
Solution Approach 1:
The heating process is rushed through quickly by applying intense heat only for the brief moment needed to melt the solder. The heating body is then immediately removed while the pressing plate maintains pressure, allowing the solder to solidify without continued heat exposure. This minimizes the total heat exposure time to the superconducting wires while still achieving proper solder melting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device significantly reduces the time required for connection, limits the deterioration of superconducting wires, and improves production efficiency by allowing continuous operation without re-heating the heating body, ensuring stable and high-performance wire connections.
Implementation Method 1
heating and pressing can be performed on the wire
Implementation Method 2
the solder is melted to connect the superconducting wires
Implementation Method 3
pressing together and heating are performed by the lower pressing and heating plate
Data Source
AI summary
A wire splicing method including: disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween, pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder; keeping the first wire and the second wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.