Wire Suspension Mounting for Reduced OIS Package Size
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Solution Overview
Problem
Small form factor cameras face challenges in achieving high image quality due to parasitic motion along axes orthogonal to the optical axis, which complicates optical image stabilization and autofocus mechanisms.
Innovation Solution
An actuator module with a suspended optics assembly using wires parallel to the optical axis, allowing motion on the XY plane for stabilization and Z-axis motion for focusing, implemented in a voice coil motor (VCM) actuator mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the camera uses a small form factor design, then the device size is reduced and portability is improved, but parasitic motion along axes orthogonal to the optical axis increases, degrading image quality
Solution Approach 1:
The camera module is segmented into functionally independent subsystems: the optics assembly suspended on wires for OIS operation, the actuator mechanism for autofocus, and the image sensor. This segmentation allows each subsystem to be optimized independently, enabling the small form factor design to achieve high image quality by isolating and compensating for parasitic motions through the wire-suspended optics assembly that can move independently on XY axes while maintaining stable Z-axis focusing capability
Solution Approach 2:
The wire suspension system acts as an intermediary mechanism between the optics assembly and the camera body. These wires enable the optics assembly to move freely in the XY plane for optical image stabilization while maintaining a stable optical axis for autofocus operation, thereby mediating between the conflicting requirements of compact size and image quality by isolating parasitic motions
2Object-affected harmful factors
If optical image stabilization mechanisms are added to compensate for unwanted lens motion, then image quality is improved, but device complexity and package size increase
Solution Approach 1:
The wire suspension system functions as a flexible support structure that replaces complex rigid mechanical OIS mechanisms. The wires allow the optics assembly to move flexibly in the XY plane to compensate for unwanted lens motion, achieving optical image stabilization without the need for complex motors, gears, or mechanical linkages that would increase device complexity and package size
Solution Approach 2:
The patent replaces traditional mechanical OIS systems (which would require motors, bearings, and complex actuation mechanisms) with a wire-suspended optics assembly. This substitution uses the simplicity of wire-based suspension to achieve the same stabilization function, significantly reducing mechanical complexity while maintaining effective compensation for unwanted lens motion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances optical image stabilization and autofocus performance by minimizing parasitic motion, thereby improving image quality in small form factor cameras for mobile devices.
Implementation Method 1
implemented in a voice coil motor (VCM) actuator mechanism
Data Source
AI summary
Some embodiments include an optics assembly. In some embodiments, the optics assembly includes an optics component. In some embodiments, the optics assembly is configured to move within the apparatus on one or more axes orthogonal to an optical axis of the optics component. In some embodiments, the optics assembly is suspended by a plurality of wires on a base component of the apparatus, each wire of the plurality of wires being substantially parallel to the optical axis of the optics component. Some embodiments include a base assembly component or substrate having an upper surface plane and a lower surface plane. In some embodiments, one or more terminations are disposed around the plurality of wires. In some embodiments, the terminations are located beyond the upper surface plane of the base assembly component.