Wire-Implanted Through-Hole Connections for High-Aspect-Ratio Boards
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Solution Overview
Problem
Conventional chemical plating or electroplating methods struggle to form conductive films in holes with high depth-to-diameter ratios, leading to difficulties in electrical connection between circuit layers on the upper and lower surfaces of electronic devices.
Innovation Solution
A manufacturing system and method involving a fixture with channels, wire mechanisms, and a wire breaking mechanism, where wires are implanted through holes and cut to form segments, with the free end welded to the circuit layer using laser energy, enabling direct electrical connection without relying on chemical plating or electroplating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chemical plating or electroplating is used to form conductive films in holes, then electrical connection between circuit layers is achieved, but it becomes difficult to form conductive films in holes with high depth-to-diameter ratio
Solution Approach 1:
The invention extracts the wire from the plating process entirely. Instead of forming conductive films through chemical or electrochemical reactions in the hole, a solid wire is directly inserted into the hole and welded to the circuit layers, completely bypassing the plating process and its associated difficulties with high depth-to-diameter ratio holes.
Solution Approach 2:
The invention replaces the chemical/electrochemical plating system with a mechanical wire insertion and welding system. The wire is mechanically inserted into the hole through a fixture, and then welded to the circuit layers, substituting the complex plating chemistry with straightforward mechanical operations.
2Ease of manufacture
If conventional chemical plating or electroplating process is used, then conductive film can be formed in holes, but the manufacturing process becomes complex and costly
Solution Approach 1:
The invention removes the entire plating process (chemical reagents, electrochemical equipment, multiple processing steps) and replaces it with simple wire insertion and welding, dramatically simplifying the manufacturing process and reducing material requirements.
Solution Approach 2:
The invention uses simple, inexpensive wires as disposable conductive elements rather than requiring complex plating processes. The wires are straightforward metal conductors that are inserted and welded, eliminating the need for costly plating chemicals, equipment, and multi-step processes.
3Reliability
If chemical plating or electroplating is used to form conductive films, then electrical connection is achieved, but environmental pollution increases
Solution Approach 1:
The invention extracts and eliminates the plating chemicals and electrochemical processes that cause environmental pollution. By using mechanical wire insertion and welding instead, all the harmful chemicals, waste streams, and environmental concerns associated with plating are completely removed from the manufacturing process.
Solution Approach 2:
The invention replaces the chemically-intensive plating system with a mechanically-based wire insertion and welding system, eliminating the environmental pollution generated by plating chemicals, heavy metal waste, and complex chemical processing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and enhances reliability by directly forming electrical connections, reducing the risk of failure associated with high depth-to-diameter ratio holes, while being environmentally friendly.
Implementation Method 1
The wire breaking mechanism is located between the fixture and the target platform, and is configured to cut the wires so as to form a plurality of wire segments.
Implementation Method 2
each of the wires moves in the wire-forward direction, and the wire-forward direction is perpendicular to the top surface
Data Source
AI summary
An electronic device manufacturing system includes a fixture, a target platform, wire mechanisms and a wire breaking mechanism. The fixture has a substrate defining plural channels. The target platform is located at one side of the fixture and defines a plane and plural target positions. Each wire mechanism has a shaft and a wire. The channels of the fixture correspond to at least part of the target positions, and the wire mechanisms correspond to the channels, respectively. The wire of each wire mechanism passes through the corresponding channel, and the fixed end thereof is located at the other side of the fixture, while the free end thereof is located on the target platform and corresponds to one of the target positions. The wire breaking mechanism is located between the fixture and the target platform for cutting the wires so as to form plural wire segments.