Wirebonded Heat-Dissipation Structure for Semiconductor Packages
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Solution Overview
Problem
Semiconductor packages face challenges in heat dissipation, as existing solutions like heat slugs and heat sinks are expensive and bulky, and current bonding techniques may not adequately protect wirebonded members from environmental damage.
Innovation Solution
The implementation of heat-dissipating wirebonded members with a gauge of at least 5 mils, exposed to the package environment and bonded using techniques like wedge, ribbon, or ball bonds, which are less expensive and more firmly coupled to conductive members, allowing for effective heat transfer without the need for extensive mold compound coverage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat slugs and heat sinks are used for heat dissipation, then heat dissipation effectiveness is improved, but cost and package size increase
Solution Approach 1:
The patent extracts the heat dissipation function from traditional bulky heat slugs and heat sinks, and implements it through wirebonded members that are already present in the package structure. The wirebonded members serve dual purposes: electrical connection and heat dissipation, eliminating the need for separate heat dissipation components.
Solution Approach 2:
The wirebonded members perform multiple functions simultaneously: they provide electrical connection between the semiconductor die and external circuits, and they serve as heat dissipation pathways. This multi-functionality reduces the overall package complexity and eliminates the need for dedicated heat dissipation structures.
2Ease of manufacture
If wirebonded members are used for bonding, then manufacturing flexibility is improved, but protection from environmental damage is insufficient
Solution Approach 1:
The patent changes the physical parameters of the wirebonded members by using thicker gauge wires (at least 5 mils) and exposing them to the package environment rather than covering them with mold compound. This parameter change enhances both their mechanical robustness and heat dissipation capability while maintaining ease of manufacture.
Solution Approach 2:
Instead of protecting the wirebonded members by covering them with mold compound as in traditional approaches, the patent inverts the approach by intentionally exposing the wirebonded members to the package environment. This inversion allows the wirebonded members to serve as heat dissipation pathways while their robust construction provides inherent protection.
3Temperature
If heavy-gauge wirebonded members are used, then heat transfer effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The wirebonded members serve themselves by performing both electrical connection and heat dissipation functions without requiring additional components or complex manufacturing processes. The same wirebonded members that are already part of the package structure are utilized for heat dissipation, eliminating the need for separate heat dissipation components and reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides efficient heat dissipation while reducing thermal resistance and costs, as wirebonded members are smaller and more robust, maintaining manufacturing flow efficiency and minimizing mechanical damage risks.
Implementation Method 1
heat-dissipating wirebonded members... allowing for effective heat transfer... reducing thermal resistance
Data Source
AI summary
In some examples, a semiconductor package includes a semiconductor die having a device side and a non-device side opposing the device side. The device side has a circuit formed therein. The package includes a first conductive member having a first surface coupled to the non-device side of the semiconductor die and a second surface opposing the first surface. The second surface is exposed to a top surface of the semiconductor package. The package includes a second conductive member exposed to an exterior of the semiconductor package and coupled to the device side of the semiconductor die. The package includes a plurality of wirebonded members coupled to the second surface of the first conductive member and exposed to the exterior of the semiconductor package. At least one of the wirebonded members in the plurality of wirebonded members has a gauge of at least 5 mils.