Wirebonded Hybrid LED Package With Bottom-Side Heat Dissipation

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Solution Overview

Problem

The challenge in precision control lighting applications is the effective heat dissipation and integration of passive components in small addressable LED systems, where conventional heat dissipation methods through the top surface are not practical due to light emission, and existing solutions often require unconventional components and manufacturing processes.

Innovation Solution

A hybridized LED device is integrated with a silicon backplane and passive components on a packaging substrate, utilizing conductive connectors and a metal inlay for thermal coupling and efficient heat dissipation through the bottom surface, allowing for a large number of passive components to be placed on the top surface in close proximity to the LED array.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional heat dissipation methods through the top surface are used, then heat dissipation is achieved, but light emission is blocked

Engineering Contradiction:

Improveheat dissipationVSAvoidlight emission

Core Design Contradiction:

TemperatureVSIllumination intensity

Solution Approach 1:

The patent inverts the conventional heat dissipation approach by dissipating heat through the bottom surface of the packaging substrate rather than through the top surface. This allows light to emit freely from the top surface while heat is conducted away through the substrate and metal inlay at the bottom, resolving the conflict between light emission and heat dissipation.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The patent transitions heat dissipation from a two-dimensional top-surface approach to a three-dimensional solution involving the substrate thickness and bottom surface. By extending heat dissipation pathways into the vertical dimension through the substrate and metal inlay, the design enables simultaneous light emission from the top and heat dissipation from the bottom.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Device complexity

If a large number of passive components are integrated close to the LED array, then component integration is improved, but heat dissipation becomes more difficult

Engineering Contradiction:

Improvecomponent integrationVSAvoidheat dissipation

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The patent segments the thermal management function from the component integration function. Passive components are integrated on the top surface for electrical functionality, while a separate thermal management system consisting of the packaging substrate and bottom metal inlay handles heat dissipation. This segmentation allows high component density without compromising thermal performance.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The packaging substrate acts as an intermediary between the LED array with passive components and the heat sink. It provides both mechanical support for component integration and thermal conduction pathway to the metal inlay and external heat sink, enabling simultaneous component placement and heat management.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Volume of moving object

If the system size is reduced for precision control applications, then compactness is achieved, but heat dissipation and component integration become more challenging

Engineering Contradiction:

Improvesystem sizeVSAvoidheat dissipation

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent changes the thermal conduction parameters by using a metal inlay with high thermal conductivity at the bottom of the packaging substrate. This high-conductivity thermal pathway enables efficient heat dissipation from the compact LED array and passive components, allowing small system size without compromising thermal management.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables effective heat dissipation and efficient integration of passive components, addressing the challenges of heat management and component placement in compact LED systems while maintaining a low profile, suitable for applications like vehicle headlamps and other precision lighting.

Implementation Method 1

conductive connectors are electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

utilizing conductive connectors and a metal inlay for thermal coupling and efficient heat dissipation through the bottom surface

Methodology Applied

Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS11756947B2Light-emitting diode lighting system with wirebonded hybridized device

Publication Date: 2023.09.12 LUMILEDS SINGAPORE PTE LTD

AI summary

Light-emitting devices are described herein. A device includes a packaging substrate having a top surface and a bottom surface and a hybridized device having a bottom surface on the top surface of the packaging substrate. The hybridized device includes a silicon backplane that includes input/output (I/O) pins and a light-emitting diode (LED) array having a bottom surface on a top surface of the silicon backplane. Passive components are disposed on the top surface of the packaging substrate. Conductive connectors are electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate.