Wirebonded Semiconductor Packages with Elongated Electrodes
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Solution Overview
Problem
Conventional semiconductor device packages with elongated electrodes face issues of increased package resistance, unwanted inductance, and unequal current distribution due to long and varying lengths of wirebonds, which also lead to higher costs and susceptibility to wire sweep during the mold process.
Innovation Solution
The configuration of extended bond pads parallel to and adjacent to elongated electrodes allows for wirebonds of equal lengths, reducing resistance and inductance, and ensuring equal current distribution by spacing them substantially parallel along the electrode and bond pad.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional package formats with bond pads arranged across the bottom are used, then the device structure is simple and easy to manufacture, but the wirebonds become long and of varying lengths, resulting in increased package resistance and unwanted inductance
Solution Approach 1:
The bond pads are repositioned from the bottom surface to the top surface of the lead frame, changing the spatial dimension of the connection path. This dimensional change allows wirebonds to connect adjacent bond pads and electrodes in a shorter, more direct path, reducing package resistance and inductance while maintaining ease of manufacture through standard wirebonding processes
2Ease of manufacture
If conventional bond pad arrangement is used, then the manufacturing process is simple, but the wirebonds have unequal lengths causing unequal current distribution across the device
Solution Approach 1:
The bond pads and electrodes are arranged in an asymmetric configuration where bond pads are positioned adjacent to their corresponding electrodes on the top surface. This asymmetric layout creates equal-length wirebond paths for all connections, ensuring uniform current distribution across the device while maintaining manufacturing simplicity through straightforward wirebond routing
3Ease of manufacture
If long wirebonds are used to connect elongated electrodes to bottom bond pads, then the device structure is conventional and easy to manufacture, but the wirebonds become susceptible to wire sweep during the mold process
Solution Approach 1:
The wirebonds are established in advance during the wirebonding process before the mold compound is applied. By completing all wirebond connections while the lead frame is still accessible, the wirebonds are secured in their final positions and protected from wire sweep damage during subsequent molding operations, maintaining both ease of manufacture and wirebond reliability
Data Source
AI summary
A device package includes at least one semiconductor device having at least one electrode of an elongated length. The device package also includes at least one conductive pad that extends parallel to the elongated length of the electrode. A terminal lead may be integral with the conductive pad. A plurality of wirebonds of about the same length may electrically connect the conductive pad and the elongated electrode of the semiconductor device. As another alternative, a second semiconductor device may be mounted to the conductive pad and a plurality of wirebonds may electrically connect this second device and the elongated electrode of the first semiconductor device.