Wired Circuit Board Edge Structure for Casing Damage Prevention
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Solution Overview
Problem
Conventional wired circuit boards with thin metal supporting boards are prone to damage during transportation, leading to reduced reliability due to contact with casing walls, while thicker boards may cause damage to the casing, affecting electrical characteristics.
Innovation Solution
A wired circuit board design with a metal supporting layer thickness of 50 μm or more and an extension part on the insulating base layer to reduce contact with the casing walls during transport, maintaining board reliability and rigidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the thickness of the metal supporting board is increased to 50 μm or more to improve rigidity, then the board can meet structural requirements, but the peripheral edge is more likely to damage the casing during transportation
Solution Approach 1:
An insulating base layer is introduced as an intermediary between the metal supporting board and the casing. This base layer has a peripheral edge that extends beyond the metal supporting board's peripheral edge, creating a buffer zone that prevents direct contact between the rigid metal board and the casing wall during transportation, thereby eliminating the harmful effect while preserving the required rigidity.
2Object-affected harmful factors
If the thickness of the metal supporting board is kept thin (25 μm or less) to avoid damaging the casing, then the casing is protected, but the board lacks sufficient rigidity for certain applications
Solution Approach 1:
The insulating base layer serves as a protective intermediary that allows the metal supporting board to maintain its required thickness and rigidity without directly contacting the casing. The base layer's peripheral edge extends outward to contact the casing wall first, absorbing the impact and protecting both the casing and the metal board from damage.
3Stability of the object's composition
If the peripheral edge of the metal supporting board contacts the peripheral side wall during transportation, then vibration movement is constrained, but foreign matter is generated that reduces electrical reliability
Solution Approach 1:
The insulating base layer with its extended peripheral edge acts as a mediator between the metal supporting board and the casing wall. It allows the board to maintain stable positioning during transportation while preventing direct contact that would generate conductive foreign matter, thereby preserving electrical reliability.
Solution Approach 2:
The insulating base layer provides a uniform insulating barrier around the entire peripheral edge of the metal supporting board, ensuring consistent protection against foreign matter generation across all contact points with the casing wall during transportation.
Data Source
AI summary
A wired circuit board includes a metal supporting layer, an insulating base layer and a conductor layer from bottom to top. A peripheral edge of the insulating base layer includes an extension part extending further outward relative to the metal supporting layer. The metal supporting layer has a thickness T1 of 50 μm or more.