Wired Circuit Board Bonding to Cut Interface Resistance
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Solution Overview
Problem
Existing methods for producing wired circuit boards result in electrical resistance at the interfaces between the metal foil and the thin metal film, and between the thin metal film and the metal support board, hindering the reduction of electrical resistance, particularly when grounding is required.
Innovation Solution
A method involving the preparation of substrates with insulating and conductive layers, followed by laminating and bonding these substrates in vacuum to reduce interface resistance, using interface and solid phase bonding, and patterning after bonding to ensure reliable adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a thin metal film is formed between the metal foil and the metal support board to improve adhesion strength, then adhesion strength is improved, but electrical resistance increases at the interfaces
Solution Approach 1:
The patent removes the thin metal film layer from the structure, extracting the source of electrical resistance. By directly bonding the metal foil to the metal support board without the intermediate thin metal film, the invention eliminates the additional interface resistance while maintaining adhesion strength through direct metal-to-metal bonding.
Solution Approach 2:
The invention uses a composite structure consisting of the metal foil directly bonded to the metal support board, creating a seamless metallic composite. This direct bonding approach forms a unified conductive path without the need for separate adhesion layers, thereby reducing electrical resistance while maintaining structural integrity.
2Reliability
If multiple layers are bonded together to reduce electrical resistance, then electrical resistance is reduced, but adhesion strength may be compromised
Solution Approach 1:
The invention creates a direct metal-to-metal composite structure where the metal foil is bonded directly to the metal support board. This composite approach eliminates intermediate layers that would increase resistance, while the direct metallic bonding provides sufficient adhesion strength for the application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces electrical resistance between conductive and metal layers, enhances adhesion strength, and improves production efficiency through a roll-to-roll system.
Implementation Method 1
the conductive layer and the metal layer are bonded by interface bonding
Implementation Method 2
the conductive layer and the metal layer are bonded by solid phase bonding
Implementation Method 3
a first step of activating a surface of the conductive layer and a surface of the metal layer and a second step of bonding the activated surface of the conductive layer and the activated surface of the metal layer are carried out in vacuum
Data Source
AI summary
Provided is a method for producing a wired circuit board in which a first preparation step of preparing a first substrate having an insulating layer and a conductive layer disposed on one surface of the insulating layer; a second preparation step of preparing a second substrate having a metal layer; a bonding step of laminating the first substrate and the second substrate so that the conductive layer and the metal layer are in contact with each other, and metal-bonding the conductive layer and the metal layer; and a patterning step of forming a conductive pattern on the other surface of the insulating layer are carried out.