Wired Circuit Board Adhesion via Thermal Treatment
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Solution Overview
Problem
The existing methods for producing suspension boards with circuits face issues with insufficient adhesion between the metal thin film and the metal supporting board, leading to peeling of the ground terminal, particularly when the ground terminal is narrow and the contact area is small.
Innovation Solution
A method involving the formation of a conductive thin film on the insulating layer and metal supporting layer, followed by heating the film at 180 to 350°C for 1 to 3 hours to enhance adhesion, and forming a continuous metal connecting portion using plating, which improves the connection reliability between the metal connecting portion and the supporting layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the ground terminal is formed to be narrow to achieve high density arrangement, then the contact area between the metal supporting board and the metal thin film becomes small, but the adhesion between them becomes insufficient leading to peeling
Solution Approach 1:
The metal supporting board is subjected to preliminary processing to form a metal oxide layer before depositing the metal thin film. This preliminary oxidation creates a surface that enhances adhesion between the metal thin film and the supporting board, preventing peeling even when the ground terminal is narrow for high density arrangement.
Solution Approach 2:
The surface properties of the metal supporting board are changed by controlling the oxidation process, creating a metal oxide layer with specific characteristics that improve adhesion. This parameter change in surface chemistry allows narrow ground terminals to maintain sufficient adhesion without peeling.
2Reliability
If the contact area between metal supporting board and metal thin film is increased to improve adhesion, then the ground terminal becomes wider, but the density arrangement of conductive pattern is reduced
Solution Approach 1:
The metal oxide layer is formed locally at the contact areas between the metal thin film and the metal supporting board, specifically at the ground terminal regions. This localized surface modification provides enhanced adhesion precisely where needed, allowing narrow ground terminals to maintain strong adhesion without requiring increased contact area or wider terminals.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents peeling of the metal connecting portion from the metal supporting layer, enhancing the connection reliability and reducing noise caused by potential differences.
Implementation Method 1
heating the conductive thin film
Implementation Method 2
heating the conductive thin film... to enhance adhesion
Implementation Method 3
forming a metal connecting portion to be continuous to the conductive pattern on the conductive thin film that is formed on the metal supporting layer... formed by a plating
Data Source
AI summary
A method for producing a wired circuit board includes the steps of preparing a metal supporting layer, forming an insulating layer on the metal supporting layer so as to form an opening, forming a conductive thin film on the insulating layer and on the metal supporting layer that is exposed from the opening of the insulating layer, heating the conductive thin film, forming a conductive pattern on the conductive thin film that is formed on the insulating layer, and forming a metal connecting portion to be continuous to the conductive pattern on the conductive thin film that is formed on the metal supporting layer exposing from the opening of the insulating layer.