Wired Circuit Board Thin Metal Foil Sputtering
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Solution Overview
Problem
Conventional suspension boards with circuits face increased transmission loss and accuracy issues in conductive pattern formation due to thick copper conductors and uneven insulating layers, leading to potential air pocket formation and reliability degradation.
Innovation Solution
A wired circuit board with a metal supporting board, a thin metal foil (<2.0 μm) formed by sputtering, and a simple layer structure including insulating layers to reduce transmission loss and ensure accurate conductive pattern formation, along with a second metal thin film as a barrier to prevent ion migration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a thick lower conductor (5 μm) is used to reduce transmission loss, then transmission loss is reduced, but a large level difference is produced in the insulating base layer causing displacement of the conductive pattern
Solution Approach 1:
The invention changes the thickness parameter of the lower conductor from the conventional 5 μm to a thinner range of 2 to 12 μm (specifically 2 to 5 μm in preferred embodiments). This parameter change reduces the level difference in the insulating base layer while maintaining the signal transmission function, thus resolving the contradiction between reducing transmission loss and maintaining manufacturing precision.
2Loss of energy
If a thick lower conductor is used, then transmission loss is reduced, but air pockets are more likely to form in the insulating cover layer degrading reliability
Solution Approach 1:
By changing the lower conductor thickness parameter to a thinner range (2 to 5 μm), the invention reduces the level difference that causes air pocket formation during insulating cover layer application. This eliminates the reliability degradation while maintaining adequate transmission loss reduction through the optimized conductor configuration.
3Manufacturing precision
If a thin metal foil (<2.0 μm) is used, then level difference is reduced improving manufacturing precision, but transmission loss reduction effectiveness may be compromised
Solution Approach 1:
The invention uses a composite structure consisting of a thin lower conductor (2 to 12 μm) in combination with record-side and reproduction-side conductors on the insulating layer. This composite configuration compensates for the reduced thickness of the lower conductor by adding additional conductive layers, thereby maintaining transmission loss reduction effectiveness while achieving the manufacturing precision benefits of a thinner base conductor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces transmission loss, ensures accurate conductive pattern formation, and enhances long-term reliability by minimizing level differences and air pocket formation, while simplifying the production process and reducing production costs.
Implementation Method 1
a metal foil formed on the metal supporting board by sputtering to have a thickness of less than 2.0 μm
Data Source
AI summary
A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer.