Wired Glazing Busbar Adhesive Bonding Process
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Solution Overview
Problem
Existing glazing manufacturing processes for automotive windscreens with heating wires suffer from 'solder splash' and 'tin splash' faults due to the use of heated irons, leading to lower process yields and potential electrical connection issues.
Innovation Solution
The use of an adhesive layer to bond the first busbar to the interlayer material and an auxiliary adhesive layer to position the auxiliary busbar eliminates the need for heated iron steps, while coating all busbar surfaces with low melting point solder prevents 'tin splash' faults, ensuring stable electrical connections and positional control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heated iron is used to embed the busbar in the interlayer material, then the busbar becomes securely fixed in position, but solder splash faults occur and electrical connection reliability deteriorates
Solution Approach 1:
An adhesive layer is introduced as an intermediary substance between the busbar and the interlayer material. This adhesive layer enables secure bonding and positional control without requiring heated iron processing, thereby eliminating solder splash faults while maintaining reliable electrical connections between the heating wires and busbar assembly
Solution Approach 2:
The mechanical/thermal embedding process using a heated iron is replaced with a chemical bonding process using an adhesive layer. This substitution eliminates the high-temperature processing step that causes solder splash, while still achieving secure fixation of the busbar in the interlayer material through adhesive bonding
2Reliability
If low melting point solder is applied to the busbar surface, then electrical connection is improved, but tin splash faults occur during manufacturing
Solution Approach 1:
The busbar surfaces are pre-coated with low melting point solder before assembly. This preliminary action ensures that when the adhesive layer is applied and cured, the solder is already in position to provide durable electrical connections without requiring subsequent high-temperature soldering operations that would cause tin splash
Solution Approach 2:
The melting point parameter of the solder is specifically selected to be low (lower than the autoclave temperature but sufficient to remain solid during assembly). This parameter change allows the solder to be applied in a controlled state and only melt during the autoclave process where it is contained, preventing tin splash faults while ensuring reliable electrical connections
3Productivity
If the manufacturing process is simplified to eliminate heated iron steps, then productivity is improved, but bonding reliability may deteriorate
Solution Approach 1:
The adhesive layer serves as a mediator that enables reliable bonding without the need for heated iron processing. This allows the manufacturing process to be simplified and productivity improved, while the adhesive ensures bonding reliability is maintained or even enhanced through more consistent and controlled application
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces 'solder splash' and 'tin splash' faults, improving process yield and maintaining durable electrical connections without detrimental effects on in-service performance, thereby enhancing the reliability of the glazing.
Implementation Method 1
an adhesive layer, bonding the first busbar to the ply of interlayer material
Implementation Method 2
coating all busbar surfaces with low melting point solder prevents 'tin splash' faults, ensuring stable electrical connections
Implementation Method 3
an auxiliary adhesive layer, arranged where an edge of the auxiliary busbar extends beyond an edge of the first busbar, bonding the auxiliary busbar to the ply of interlayer material
Data Source
Figure 1~2
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AI summary
A wired glazing is disclosed comprising a ply of interlayer material, having a first busbar and an auxiliary busbar and heating wires between them. An adhesive layer is arranged between the first busbar and the ply of interlayer material. An auxiliary adhesive layer is arranged where an edge of the auxiliary busbar extends beyond an edge of the first busbar. The auxiliary adhesive layer bonds the auxiliary busbar to the ply of interlayer material. A corresponding process for manufacturing a wired glazing is disclosed.