Wireless Alignment Wafer for Wafer Handling Robot Calibration
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Solution Overview
Problem
Conventional semiconductor manufacturing alignment wafers require wired connections, which are unsafe and labor-intensive, leading to increased downtime and manual intervention, making the robot handling setup time-consuming and inefficient.
Innovation Solution
A wireless alignment device with a sensor and transmitter mounted on a substrate, allowing for safe and automated alignment of wafer handling robots within semiconductor processing systems, eliminating the need for wired connections and manual intervention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wired connections are used for alignment wafers, then power and data transmission are reliable, but safety is compromised and manual intervention is required
Solution Approach 1:
The patent replaces the mechanical wired connection system with a wireless communication system. The alignment wafer incorporates a wireless transmitter that communicates with the robot system via wireless signals, eliminating physical wires that posed safety hazards. This substitution maintains reliable power and data transmission while removing the harmful mechanical connections.
Solution Approach 2:
The patent introduces a wireless communication intermediary (transmitter and receiver system) between the alignment wafer and the robot control system. This intermediary enables power and data transmission without direct physical connections, resolving the contradiction between reliable transmission and safety hazards.
2Stability of the object's composition
If wired alignment wafers are used, then connection stability is maintained, but setup time increases due to manual intervention
Solution Approach 1:
The patent implements self-service functionality where the wireless alignment wafer automatically transmits its position and alignment data to the robot control system without requiring manual intervention. The robot system can autonomously receive and process the wireless signals, eliminating the time-consuming manual setup process while maintaining connection stability through reliable wireless communication.
Solution Approach 2:
By replacing the manual mechanical connection and adjustment process with an automated wireless communication system, the patent eliminates the need for operators to physically connect and adjust wired alignment wafers. The wireless system enables automatic data exchange, significantly reducing setup time while maintaining system stability.
3Loss of information
If conventional dummy wafers are used, then alignment information can be obtained, but user intervention is required at every stage
Solution Approach 1:
The patent implements self-service functionality where the wireless alignment wafer automatically transmits its position and alignment data to the robot control system without requiring manual intervention. The robot system can autonomously receive and process the wireless signals, eliminating the time-consuming manual setup process while maintaining connection stability.
Solution Approach 2:
The patent incorporates a feedback mechanism where the wireless alignment wafer continuously transmits alignment information to the robot control system. The system receives this feedback and uses it to automatically adjust and verify alignment, enabling fully automated alignment processes without user intervention at every stage.
4Use of energy by moving object
If wired alignment devices are used, then power supply is reliable, but device complexity increases due to wire management
Solution Approach 1:
The patent replaces the complex mechanical wire management system with a wireless power and data transmission system. The wireless alignment wafer incorporates a transmitter that receives power and transmits data wirelessly, eliminating the need for physical wire connections and their associated management complexity while maintaining reliable power supply.
Solution Approach 2:
The patent introduces a wireless communication intermediary that handles power and data transmission without requiring physical wire connections. This intermediary system simplifies the overall device complexity by removing wire management requirements while maintaining reliable power supply to the alignment wafer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The wireless alignment device reduces setup time by 60% and enhances safety, enabling fully automated robot alignment across multiple modules without manual intervention, thereby improving productivity and reducing the risk of quality or safety incidents.
Implementation Method 1
The camera may be configured to receive radiation from the interior of the wafer processing module
Implementation Method 2
The reflecting element may be located on the first surface of the substrate and at an acute angle to the first surface of the substrate. The reflecting element may be configured to direct radiation that is incident on the reflecting element from the interior of the wafer processing module to the camera
Data Source
AI summary
An alignment device for aligning a wafer handling robot in a wafer processing system includes a substrate having a through-hole. A sensor is mounted on a first surface of the substrate, and configured to capture, via the through-hole, information relating to a position of the alignment device in the wafer processing system. A transmitter is mounted on the first surface of the substrate and coupled to the sensor. The transmitter is configured to wirelessly transmit the information captured by the sensor. The transmitted information enables to determine whether the alignment device is within a threshold distance from a target position in the wafer processing system and to adjust the position of the alignment device. A method of aligning the wafer handling robot utilizing the alignment wafer, and a frame and method for calibrating the alignment wafer are also provided.